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Research article

First published 2022-5

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

K. Georgy, Sanjay Tikale, K. Narayan Prabhu

Materials Science and Technology

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Research article

First published 2020-4

Fabrication of a Three-Layer PDMS Pneumatic Microfluidic Chip for Micro Liquid Sample Operation

Xuling Liu, Songjing Li

Journal of Laboratory Automation

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Research article

First published 2015-3

Rapid Induction of Hypothermia by the ThermoSuit System Profoundly Reduces Infarct Size and Anatomic Zone of No Reflow Following Ischemia–Reperfusion in Rabbit and Rat Hearts

Michael J. Herring, Wangde Dai, Sharon L. Hale [...]

Journal of Cardiovascular Pharmacology and Therapeutics

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Research article

First published 2004-9

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

K-C Chang, M-K Yeh, K-N Chiang

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2023-9

Ultrasonic inspection during autoclave cure of reflowable-interface composite joints

Tyler B Hudson, Fatimata Baro, Austin J Smith [...]

Journal of Composite Materials

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Research article

First published 2007-4

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

J.-W. Yoon, S.-W. Kim, S.-B. Jung

Materials Science and Technology

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Research article

First published 2025-3

Modelling wetting angle of solder on substrate using machine learning approach

Bing-Xi Lee, Yu-chen Liu

Science and Technology of Welding and Joining

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Research article

First published 2012-7

Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips

M L Huang, J L Pan, H T Ma [...]

Materials Science and Technology

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Review article

First published 2011-6

Mild Hypothermia as a Cardioprotective Approach for Acute Myocardial Infarction: Laboratory to Clinical Application

Sharon L. Hale, Robert A. Kloner

Journal of Cardiovascular Pharmacology and Therapeutics

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Research article

First published 2023-9

Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering

Abdella Ahmmed Simegnaw, Benny Malengier, Melkie Getnet [...]

Textile Research Journal

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