The effect of reflow time and reflow temperatures on wettability and bond shear strength of Sn–3.5Ag solder alloy on a Cu substrate is assessed for reflow times of 10 s, 100 s, 300 s, 500 s and reflow temperatures of 250 °C, 270 °C, 290 °C, 320 °C. The wetting regime was found to have capillary, gravity, and viscous regimes. A microstructural study using a scanning electron microscope (SEM) with energydispersive spectroscopy revealed the presence of intermetallic compounds at the interface between the substrate and solder droplet. The bond strength of the solder joint is maximum at a reflow temperature of 250 °C and a reflow time of 10 s. Bond shear strength decreased with an increase in reflow time from 10 s to 500 s. The effect of different cooling conditions on the solder–substrate joint is also investigated.
MaHSuhlingJC.A review of mechanical properties of lead-free solders for electronic packaging. J Mater Sci. 2009; 44:1141–1158.
2.
KotadiaHRHowesPDMannanSH.A review: on the development of low melting temperature Pb-free solders. Microelectron Reliab. 2014; 54:1253–1273.
3.
YenYDwiAYangC.Investigation of the interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu solder and Cu Ti alloy (C1990HP). Microelectron Reliab. 2019; 96:29–36.
4.
SaidMNazeriMFMSharifN. Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn-3.0Ag-0.5Cu/Cu solder joints. Solder Surf Mt Technol. 2022; 1: 31–44.
5.
SatyanarayanKNPPrabhuK N.Wetting behaviour and interfacial microstructure of Sn–Ag–Zn solder alloys on nickel coated aluminium substrates. Mater Sci Technol. 2011; 27:1157–1162.
6.
AdawiyahMARAzlinaOS.Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints. J Alloys Compd. 2018; 740:958–966.
7.
ChoiWKLeeHM.Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate. J Electron Mater. 2000; 29:1207–1213.
8.
DengXSidhuRSJohnsonPInfluence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints. Metall Mater Trans A. 2005; 36:55–64.
9.
MaveetyJGLiuPVijayenJEffect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders. J Electron Mater. 2004; 33:1355–1362.
10.
OchoaFWilliamsJJChawlaN.Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder. J Electron Mater. 2003; 32:1414–1420.
11.
AbdelhadiOMLadaniL.IMC growth of Sn-3.5Ag/Cu system: combined chemical reaction and diffusion mechanisms. J Alloys Compd. 2012; 537:87–99.
12.
ChuangTHWuHMChengMDMechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates. J Electron Mater. 2004; 33:22–27.
13.
SharifAChanYC.Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow. Mater Sci Eng B: Solid-State Mater Adv Technol. 2004; 106:126–131.
14.
GumaanMSMostafaREsmailSCopper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy. J Mater Sci: Mater Electron. 2018; 29:8886–8894.
15.
SonaMPrabhuKN.The effect of wetting gravity regime on shear strength of SAC and Sn-Pb solder Lap joints. J Mater Eng Perform. 2017; 26:4177–4187.
16.
SonaMPrabhuKN.The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn–Cu solder alloy. J Mater Sci: Mater Electron. 2014; 25:1446–1455.
17.
ShnawahDASabriMFMBadruddinIA.A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. Microelectron Reliab. 2012; 52:90–99.
18.
SonaMPrabhuKN.Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints. J Mater Sci: Mater Electron. 2013; 24:3149–3169.
19.
SaudNNgKFSaidRM.. Microstructure evolution and phase formation of transient liquid phase Sn/Ag solder alloy via multiple reflow soldering method. International Conference on Advanced Materials Engineering & Technology; 2020.
20.
XuZSharmaALeeSJEffect of soldering temperature on wetting and optical density of dip coated Sn and Sn-3.5Ag solders. Mater Manuf Processes. 2015; 30:127–132.
21.
PanikarRSAmogha SkandaVTikaleSThe effect of reflow temperature on time at the end of gravity zone (Tgz) of Sn-3.8Ag-0.7Cu solder alloy. Mater Perform Charact. 2020; 9:20190230.
22.
LeeLMMohamadAA.Adv Mater Sci Eng. 2013; 2013.
23.
ChadaSFournelleRALaubWCopper substrate dissolution in eutectic Sn-Ag solder and its effect on microstructure. J Electron Mater. 2000; 29:1214–1221.
24.
LaurilaTVuorinenVKivilahtiJK.Interfacial reactions between lead-free solders and common base materials. Mater Sci Eng R: Rep. 2005; 49:1–60.
DengXPiotrowskiGWilliamsJJInfluence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints. J Electron Mater. 2003; 32:1403–1413.
27.
SamuelATikaleSPrabhuKN.Assessment of the performance of Sn–3.5Ag/Cu solder joint under multiple reflows, thermal cycling and corrosive environment. Trans Indian Inst Met. 2018; 71:2687–2691.
