Sage Journals: Discover world-class research

Abstract

The interfacial reactions between Sn–0·7 wt-%Cu solder and electroless nickel immersion gold (ENIG) substrate were investigated during multiple reflows and isothermal aging at temperatures between 70 and 150°C for aging times of up to 60 days. After reflowing and aging, the intermetallic compound (IMC) formed at the interface was only (Cu,Ni)₆Sn₅. In addition, a P rich Ni (Ni₃P) layer formed at the interface between the (Cu,Ni)₆Sn₅ and the Ni–P layer. The thickness of the interfacial (Cu,Ni)₆Sn₅ IMC layer slightly increased with the multiple reflows and isothermal aging. In contrast, the thickness of the Ni₃P layer did not significantly increase. The formation of the (Cu,Ni)₆Sn₅ IMC layer retarded the consumption of the Ni from the electroless Ni–P substrate. As a result, a very thin Ni₃P layer formed at the interface. In the ball shear test performed after aging treatment, the shear strength decreased for all temperatures tested until the samples had been aged for three days, and then remained at a constant value with prolonged aging. In addition, the shear strength could not be significantly related to the aging temperatures used in the present study. All fractures occurred in the bulk solder. The present study shows that the Sn–0·7Cu/ENIG solder joint has superior joint reliability with respect to shear tests.

Keywords

PB FREE SN-CU SOLDER ELECTROLESS NICKEL IMMERSION GOLD (ENIG)INTERFACIAL REACTION INTERMETALLIC COMPOUND (IMC)BALL SHEAR TEST SOLDER JOINT RELIABILITY

Get full access to this article

View all access options for this article.

References

Chen

W. T.

, Ho

C. E.

and Kao

C. R.

: J. Mater. Res., 2002, 17, 263–266.

Islam

M. N.

and Chan

Y. C.

: Mater. Sci. Eng. B., 2005, 117B, 246–253.

Yoon

J. W.

, Kim

S. W.

, Koo

J. M.

, Kim

D. G.

and Jung

S. B.

: J. Electron. Mater., 2004, 33, 1190–1199.

Suganuma

: Curr. Opin. Solid State Mater. Sci., 2001, 5, 55–64.

Yoon

J. W.

, Kim

S. W.

and Jung

S. B.

: J. Alloys Compd, 2005, 391, 82–89.

Zeng

and Tu

K. N.

: Mater. Sci. Eng. R, 2002, 38, 55–105.

Website: www.nemi.org

Frear

D. R.

, Jang

J. W.

, Lin

J. K.

and Zhang

: JOM, 2001, 53, 28–32.

Lin

J. K.

, Silva

A. D.

, Frear

, Guo

, Hayes

, Jang

J. W.

, Li

, Mitchell

, Yeung

and Zhang

: IEEE Trans. Electron. Pack Manuf, 2002, 25, 300–307.

10.

Lee

C. B.

, Lee

I. Y.

, Jung

S. B.

and Shur

C. C.

: Mater. Trans., 2002, 43, 751–756.

11.

A. C. K.

and Chan

Y. C.

: IEEE Trans. Compon. Pack. Manuf Technol. B, 1996, 198, 661–668.

12.

Zhang

, Li

, Chum

C. C.

and Tu

K. N.

: J. Mater. Res., 2002, 17, 2757–2760.

13.

Wang

S. J.

, Kao

H. J.

and Liu

C. Y.

: J. Electron. Mater., 2004, 33, 1130–1136.

14.

Islam

M. N.

, Chan

Y. C.

, Sharif

and Alam

M. O.

: Microelectron. Rehab., 2003, 43, 2031–2037.

15.

Yoon

J. W.

and Jung

S. B.

: J. Alloys Compd, 2004, 376, 105–110.

16.

Wang

S. J.

and Liu

C. Y.

: Scr. Mater., 2003, 49, 813–818.

17.

Jang

J. W.

, Kim

P. G.

, Tu

K. N.

, Frear

D. R.

and Thompson

: J. Appl. Phys., 1999, 85, 8456–8463.

18.

Yoon

J. W.

and Jung

S. B.

: Surf Interf Anal., 2004, 36, 963–965.

19.

Alam

M. O.

, Chan

Y. C.

and Tu

K. N.

: J. Mater. Res., 2004, 19, 1303–1306.

20.

Jeon

Y. D.

, Paik

K. W.

, Bok

K. S.

and Choi

W. S.

: J. Electron. Mater., 2002, 31, 520–528.

21.

Zheng

P. J.

, Lee

J. Z.

, Liu

K. H.

, Wu

J. D.

and Hung

S. C.

: Microelectron. Rehab., 2003, 43, 925–934.

22.

Kim

S. W.

, Yoon

J. W.

and Jung

S. B.

: J. Electron. Mater., 2004, 33, 1182–1189.

23.

Yoon

J. W.

, Lee

C. B.

and Jung

S. B.

: J. Electron. Mater., 2003, 32, 1195–1202.

24.

Jeon

Y. D.

, Ostmann

, Reichl

and Paik

K. W.

: Proc. IEEE 53rd Conf. on ‘Electronic components and technology’, New Orleans, LA, USA, May 2003, IEEE,1203–1208.

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

Abstract

Keywords

Get full access to this article

References