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Research article

First published 2018-2

Using improved simulated anneal arithmetic to improve semiconductor packaging ball placement process capability

Shen-Tsu Wang, Meng-Hua Li

Advances in Mechanical Engineering

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Research article

First published 2004-1

Thermal stress induced by the adhesion topology of a semiconductor integrated circuit package

D C Lee, M G Kim, J I Lee

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2015-2

Dynamic modeling and control of a novel XY positioning stage for semiconductor packaging

Fujun Wang, Zhipeng Ma, Weiguo Gao [...]

Transactions of the Institute of Measurement and Control

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Research article

First published 2000-7

Ergonomic Approach of Cutting Process for Semiconductor Packaging Plants

Chihwei Lu, Y. Ou

Proceedings of the Human Factors and Ergonomics Society Annual Meeting

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Research article

First published 1992-9

Gold in the Electronics Industry Some New Developments in Semiconductor Packaging

David M. Jacobson, Giles Humpston

Interdisciplinary Science Reviews

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Other

First published 2004-03

Analysis of the Mold Filling Process on Flip Chip Package

Y. K. Shen, S. H. Chen, H. C. Lee

Journal of Reinforced Plastics and Composites

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Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

Free access

Research article

First published 2014-10

Characterization of Peo-X Ionic Conductive Polymer for Anodic Bonding

Xu Yin, Cuirong Liu, Yue Nan [...]

Polymers and Polymer Composites

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Other

First published 1981-02

SCS begins a new service : software resources for calculators and personal computers

Fred O. Simons, Richard C. Harden

SIMULATION

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Research article

First published 2006-03

Experimental Studies for Particle Damping on a Bond Arm

K. W. Chan, W. H. Liao, M. Y. Wang [...]

Journal of Vibration and Control

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