Abstract
Anodic bonding is a common technology in MEMS packaging. However, only the bonding between glass and metal or semiconductor can be implemented at present. In this work, a new type of composite, solid polymer electrolyte (taking PEO as the matrix with a small amount of nano-sized inorganic filler), was prepared as a new anodic bonding material. We studied the interaction and conduction mechanism between PEO and the inorganic filler through DSC and XRD analyses, and also discussed the application feasibility of the solid polymer electrolyte being packaging material in anodic bonding. The results showed that adding inorganic filler can reduce the interface resistance of the macromolecule solid electrolyte, and control the diffusion of alkali metal ions in the solid lithium molecule electrolyte when under a strong electric field. The anodic bonding technique may promote the application of this new macromolecule material in MEMS.