Gold plays an important role in the electronics industry owing to its unique combination of properties which include high electrical conductivity, excellent resistance to tarnishing and corrosion and the ease with which it can be applied as a coating to a wide variety of materials. Some new developments involving the use of gold in solders for semiconductor component fabrication and fine wires for semiconductor device interconnection are described together with the associated benefits.
Get full access to this article
View all access options for this article.
References
1.
HumpstonG. and JacobsonD. M.: ‘Solder spread: a criterion for evaluation of soldering’, Gold Bull., 1990, 23, (3), 83–95.
2.
CrispinR. M. and NicholasM. G.: ‘Reactive brazing of alumina to metals’, Brazing Soldering, 1984, 6, (1), 37–39.
3.
XianA. and SiZ.: ‘Wetting of tin-based active solder on sialon ceramic’, J. Mater. Sci. Lett., 1991, 10, (22), 1315–1317.
4.
BulwithR. A. and MackayC. A.: ‘Silver scavenging inhibition of some silver loaded solders’, Weld. J., 1985, 64, (3), 86s–90s.
5.
‘Gold 1991’; 1991, London, Gold Fields Mineral Services Ltd.
6.
PoniatowskiM. and ClasingM.: ‘Dispersion strengthened gold: new material of improved strength at high temperatures’, Gold Bull., 1972, 5, (2), 34–36.
7.
GafnerG.: ‘The development of 990 gold–titanium: its production, use and properties’, Gold Bull., 1989, 22, (4), 112–122.
8.
OhnoH. and KanzawaY.: ‘Internal oxidation in gold alloys containing small amounts of Fe and Sn’, JiMater. Sci., 1983, 18, (3), 919–929.