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Research article

First published 2022-7

Investigation and multi-objective optimization of monocrystalline silicon wafering using wire electro-discharge machining

Anmol S Verma, Shankar Singh

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2020-8

Grinding Marks in Back Grinding of Wafer with Outer Rim

Xianglong Zhu, Yu Li, Zhigang Dong [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2013-7

A three-dimensional transient model to predict interfacial phenomena during chemical mechanical polishing using computational fluid dynamics

Jeremiah N Mpagazehe, C Fred Higgs

Proceedings of the Institution of Mechanical Engineers,Part J: Journal of Engineering Tribology

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Research article

First published 2021-11

Experimental investigation into polishing of monocrystalline silicon wafer using double-disc chemical assisted magnetorheological finishing process

Mayank Srivastava, Pulak M Pandey

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2008-6

An improved model considering elastic—plastic contact and partial hydrodynamic lubrication for chemical mechanical polishing

H-J Tsai, Y-R Jeng, P-Y Huang

Proceedings of the Institution of Mechanical Engineers,Part J: Journal of Engineering Tribology

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Research article

First published 2024-5

Cutting force modeling and control of single crystal silicon using wire saw velocity reciprocation

Jiabin Wang, Shujuan Li, Lie Liang [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2014-5

Surface roughness optimization in processing SiC monocrystal wafers by wire saw machining with ultrasonic vibration

Shujuan Li, Bo Wan, Robert G Landers

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2024-10

Simulation and experimental research on the abrasive trajectories of plane lapping based on rotary swing drive

Jianhui Zhu, Hang Gao, Yuchun Xu [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2021-9

Ultra-precision grinding of 4H-SiC wafer by PAV/PF composite sol-gel diamond wheel

Kaiping Feng, Tianchen Zhao, Binghai Lyu [...]

Advances in Mechanical Engineering

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Research article

First published 2006-3

Preference for Rizatriptan 10-mg Wafer vs. Eletriptan 40-mg Tablet for Acute Treatment of Migraine

MJA Láinez, S Evers, E Kinge [...]

Cephalalgia

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