Simulation and experimental research on the abrasive trajectories of plane lapping based on rotary swing drive

Abstract

In the pursuit of achieving exceptional surface shape accuracy for MPCVD (Microwave Plasma Chemical Vapor Deposition) polycrystalline diamond wafers during the free abrasive lapping process, plane lapping based on rotary swing drive was employed in this study. The crux of this study lay in the development of a comprehensive kinematic model, scrutinizing the motion behavior of abrasive particles, and probing the influence of parameters on the uniformity of abrasive trajectories. The results show that the eccentricity, arc chord length and speed ratio affect the probability of track coincidence rate, and then affect the distribution uniformity. And then the verification experiments solidifying the reliability of our kinematic model and affirming the veracity of simulation results. The best surface shape accuracy (PV) of the MPCVD polycrystalline diamond wafer was 2.3 μm under optimal parameters, representing a substantial advancement compared to the original lapping method, which only yielded a PV value of 8.4 μm. This study provides a promising method for high surface shape accuracy of MPCVD polycrystalline diamond wafers with large sizes.