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Research article

First published 2022-5

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

K. Georgy, Sanjay Tikale, K. Narayan Prabhu

Materials Science and Technology

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Research article

First published 2004-9

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

K-C Chang, M-K Yeh, K-N Chiang

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2023-9

Connecting surface-mounted electronic elements with amber strand metal-clad conductive fibers by reflow soldering

Abdella Ahmmed Simegnaw, Benny Malengier, Melkie Getnet [...]

Textile Research Journal

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Research article

First published 2006-1

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global–local finite element model

K-C Chang, K-N Chiang

The Journal of Strain Analysis for Engineering Design

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Research article

First published 2012-7

Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips

M L Huang, J L Pan, H T Ma [...]

Materials Science and Technology

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Research article

First published 2009-12

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

J.-W. Yoon, S.-B. Jung

Materials Science and Technology

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Research article

First published 1997-1

A study of the strength and shape of surface mount technology leadless chip solder joints

I. K. Hui, B Ralph

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2025-3

Modelling wetting angle of solder on substrate using machine learning approach

Bing-Xi Lee, Yu-chen Liu

Science and Technology of Welding and Joining

Open access

Research article

First published 2021

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin [...]

Nanomaterials and Nanotechnology

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Research article

First published 1998-7

The effects of exposure time on tackiness and rheology of solder paste

I K Hui, B Ralph

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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