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Articles (27)

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1-10 of 27 results for solder melt

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Select article: The behaviour of steel coated with TiB 2 in Sn-Ag-Cu melt

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Research article

First published 2019-4

The behaviour of steel coated with TiB 2 in Sn-Ag-Cu melt

Marton Benke, Zsolt Salyi, Viktor Takats [...]

Materials Science and Technology

Select article: Study on oxygen contamination during atomisation of solder powders for microelectronics

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Research article

First published 2007-9

Study on oxygen contamination during atomisation of solder powders for microelectronics

R. C. Reddy, B. S. Kiran, V. C. Sethi [...]

Powder Metallurgy

Select article: Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

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Research article

First published 1985-3

Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

C. A. MacKay, W. D. von Voss

Materials Science and Technology

Select article: Laser Soldering and Welding for Ossicular Reconstruction: An in Vitro Test

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Research article

First published 2000-6

Laser Soldering and Welding for Ossicular Reconstruction: An in Vitro Test

Moon Suh Park, Hun Ki Min

Otolaryngology–Head and Neck Surgery

Select article: Microstructures formed from mixed solders on copper substrate

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Research article

First published 2009-12

Microstructures formed from mixed solders on copper substrate

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

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Research article

First published 2007-08

The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Hsin-Chun Tsai, Wen-Ren Jong

Journal of Reinforced Plastics and Composites

Select article: Effects of Ag 3 Sn nanoparticles and isothermal aging on IMC layer growth,mechanical properties,and life prediction of SAC305/Cu solder joints

Open access

Research article

First published 2023-03

Effects of Ag 3 Sn nanoparticles and isothermal aging on IMC layer growth,mechanical properties,and life prediction of SAC305/Cu solder joints

Peng Yuan, Dongdong Chen, Junhu Qin [...]

Composites and Advanced Materials

Select article: On the advantages of Bi addition into Sn-Cu-S lead-free solder

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Research article

First published 2021-12

On the advantages of Bi addition into Sn-Cu-S lead-free solder

Huizhen Huang, Qinghuan Zhang, Gewang Shuai [...]

Materials Science and Technology

Select article: A Study of the Interaction of Pb-Sn Solder with O 2,H 2 O,and NO 2 by X-Ray Photoelectron (ESCA) and Auger (AES) Spectroscopy

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Research article

First published 1979-5

A Study of the Interaction of Pb-Sn Solder with O 2,H 2 O,and NO 2 by X-Ray Photoelectron (ESCA) and Auger (AES) Spectroscopy

Yasuaki Okamoto, William J. Carter, David M. Hercules

Applied Spectroscopy

Select article: Structure analysis of the conical heating hole for waste printed circuit boards disassembly

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Research article

First published 2022-2

Structure analysis of the conical heating hole for waste printed circuit boards disassembly

Fengfu Yin, Tianhao Chang, Lin Li [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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