The behaviour of TiB2 coated steel in Sn-Ag–Cu based solder melt was investigated. The samples were subjected to immersion tests in static solder melt for 40 days at 593 K. The reactions at the solder/native oxide layer covered TiB2/substrate and solder/oxide layer-free TiB2/substrate interfaces were investigated with X-ray diffraction, secondary neutral mass spectrometry, X-ray photoelectron spectroscopy, scanning electron microscopy and energy dispersive spectroscopy. The thermodynamic background of possible reactions is also presented. It was found that neither oxide covered, nor oxide layer-free TiB2 showed any observable reaction with the Sn-Ag–Cu solder melt.
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