Incorporation of Bi into Sn-0.7Cu-0.08S lead-free solder alloy was applied to investigate its advantages on the melting temperature, wettability, microstructure, mechanical properties and corrosion behaviour. The results indicate that the addition of Bi lowers the melting temperature of the Sn-0.7Cu-0.08S, but enlarges its pasty range. The wettability of Sn-0.7Cu-0.08S on Cu substrate is considerably enhanced with the increase of Bi, as well as the ultimate tensile strength and vickers hardness. The improvement of the mechanical properties can be attributed to the refined microstructure by Bi addition. The corrosion resistance of Sn-0.7Cu-0.08S is obviously increased with the increase of Bi content. Analyses by SEM and XRD indicate that the corrosion product on the solder alloy surface is SnO2.
RamliMIISaudNSallehMAAMEffect of TiO2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder. Microelectron Reliab. 2016; 65:255–264.
2.
SatyanaryanPrabhu KN.Reactive wetting, evolution of interfacial and bulkIMCs and their effect onmechanical properties of eutectic Sn-Cu solder alloy. Adv Colloid Interface Sci. 2011; 166:87–118.
3.
RizviMJBaileyCChanYCEffect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder, Part I: wetting behavior on Cu and Ni substrates. J Alloys Compd. 2007; 438(1–2):116–121.
4.
LiLFChengYKXuGLEffects of indium addition on properties and wettability of Sn-0.7Cu-0.2Ni lead-free solders. Mater Des. 2014; 64:15–20.
5.
WuCMLYuDQLawCMTProperties of lead-free solder alloys with rare earth element additions. Mater Sci Eng R. 2004; 44:1–44.
6.
YangLZhangYCDaiJMicrostructure, interfacial IMC and mechanical properties of Sn-0.7Cu-xAl (x=0-0.075) lead-free solder alloy. Mater Des. 2015; 67:209–216.
7.
ShenJPuYYWuDEffects of minor Bi, Ni on the wetting properties, microstructures, and shear properties of Sn-0.7Cu lead-free solder joints. J Mater Sci Mater Electron. 2015; 26:1572–1580.
8.
MahdavifardMHSabriMFMSaidSMEffects of Fe and Bi minor alloying on mechanical, thermal, and microstructural properties of Sn-0.7Cu solder alloy. J Electronic Mater. 2016; 45(7):3673–3682.
9.
ZengGMcDonaldSDGuQThe influence of Ni and Zn additions on microstructure and phase transformations in Sn-0.7Cu/Cu solder joints. Acta Mater. 2015; 83:357–371.
10.
LiGDShiYWHaoHEffect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder. J Alloys Compd. 2010; 491:382–385.
11.
HuangHZLuDShuaiGWEffects of phosphorus addition on the corrosion resistance of Sn-0.7Cu lead-free solder alloy. Trans Indian Inst Met. 2016; 69:1537–1543.
12.
HuangHZShuaiGWWeiXQEffects of sulfur addition on the wettability and corrosion resistance of Sn-Cu lead-free solder. Microelectron Reliab. 2017; 74:15–21.
13.
El-DalyAAEl-TaherAMGoudaS.Novel Bi-containing Sn-1.5Ag-0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products. Mater Des. 2015; 65:796–805.
14.
JafferyHASabriMFMSaidSMElectrochemical corrosion behavior of Sn-0.7Cu solder alloy with the addition of bismuth and iron. J Alloys Compd. 2019; 810:151925.
15.
OsórioWRFreitasESSpinelliJEElectrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution. Corros Sci. 2014; 80(3):71–81.
16.
LiDZConwayPPLiuCQ.Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solution. Corros Sci. 2008; 50:995–1004.
17.
HuangHZWeiXQLiaoFPPreparation and properties of particle reinforced Sn-Zn-based composite solder. J Wuhan Univ Technol (Mater Sci Ed). 2009; 24:206–209.
18.
NazeriMFMYahayaMZGurselACorrosion characterization of Sn-Zn solder: a review. Solder Surf Mt Technol. 2019; 31(1):52–67.
19.
LiyanaNKFazalMAHaseebASMA.Polarization and EIS studies to evaluate the effect of aluminum concentration on the corrosion behavior of SAC105 solder alloy. Mater Sci-Poland. 2018; 35(4):694–701.
20.
HansenM.Constitution of binary alloys. New York (NY): McGraw-Hill Book Co; 1958. p. 634.
21.
AlamSNMishraMKPadhyMDevelopment and characterization of Sn-Zn-Bi lead free solder. Trans Indian Inst Met. 2015; 68(5):881–896.
22.
HuangMLWangL.Effects of Cu, Bi, and In on microstructure and tensile properties of Sn-Ag-X (Cu, Bi, In) solders. Metall Trans A. 2005; 36A(6):1439–1446.
23.
XuBSChenJWYuanZFSpreading dynamics and interfacial characteristics of Sn-3.0Ag-0.5Cu-xBi melting on Cu substrates. Microgravity Sci Technol. 2016; 28:115–122.
24.
SasakiTKanagawaROhtsukaTCorrosion products of tin in humid air containing sulfur dioxide and nitrogen dioxide at room temperature. Corros Sci. 2003; 45:847–854.
25.
Wierzbricka-MiernikAGuspielJZabdyrL.Corrosion behavior of lead-free SAC-type solder alloys in liquid media. Arch Civil Mech Eng. 2015; 15(1):206–213.
26.
MoriMMiuraKSasakiTCorrosion of tin alloys in sulfuric and nitric acids. Corros Sci. 2002; 44:887–898.
27.
NazeriMFMMohamadAA.Corrosion resistance of ternary Sn-9Zn-xIn solder joint in alkaline solution. J Alloys Compd. 2016; 661:516–525.
28.
NurwahidaMZMukridzMMAhmadAMCorrosion properties of SAC305 solder in different solution of HCl and NaCl. IOP Conf Ser: Mater Sci Eng. 2018; 318:012004.
29.
LiuJCWangZHXieJYEffects of intermetallic-forming element additions on microstructure and corrosion behavior of Sn-Zn solder alloys. Corros Sci. 2016; 112:150–159.
30.
LiyanaNKFazalMAHaseebAEffect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys. J Mater Sci Mater Electron. 2019; 30(8):7415–7422.
