You are on the new improved site. You can view the old site in view-only mode here until June 27, 2026

Filter Results

Search all journals

Enter search terms…

Advanced search

/

About

About Sage
About Sage Journals
Privacy Policy
Terms of Use
Contact Us
Help

Information for

Authors
Editors
Librarians
Researchers
Reviewers
Frequently asked questions

Copyright © 2026 by Sage Publications.京ICP备09090397号-11

Search results

Search results page

Articles (57)

Journals (0)

1-10 of 57 results for chip packaging

Sort by:

Relevance

Select all

Select all

Sort by:

Relevance

Select article: Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Retricted access

Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

Select article: Mechanical strength of chip scale package with various underfills under accelerated thermal condition

Retricted access

Research article

First published 2007-7

Mechanical strength of chip scale package with various underfills under accelerated thermal condition

B.-I. Noh, B.-Y. Lee, S.-B. Jung

Materials Science and Technology

Select article: SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Retricted access

Research article

First published 2019-5

SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Qing Tian, Junhui Li, Xiao Huiwei [...]

High Performance Polymers

Select article: A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

Retricted access

Research article

First published 2009-10

A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

M. Khalil Abdullah, M.Z. Abdullah, M.A. Mujeebu [...]

Journal of Reinforced Plastics and Composites

Select article: Analysis of the Mold Filling Process on Flip Chip Package

Retricted access

Other

First published 2004-03

Analysis of the Mold Filling Process on Flip Chip Package

Y. K. Shen, S. H. Chen, H. C. Lee

Journal of Reinforced Plastics and Composites

Select article: LED chip-on-board package with high colour rendering index and high luminous efficacy

Retricted access

Research article

First published 2018-5

LED chip-on-board package with high colour rendering index and high luminous efficacy

Z Zhou, H Wang, J Zhang [...]

Lighting Research & Technology

Select article: Research Note: LED chip-on-board packaging technology for strict colour tolerance

Retricted access

Research article

First published 2017-12

Research Note: LED chip-on-board packaging technology for strict colour tolerance

J Zhang, P Ge, Z Zhou [...]

Lighting Research & Technology

Select article: The Geometrical Effects of Bumps on the Fatigue Life of Flip-chip Packages by Taguchi Method

Retricted access

Research article

First published 2006-01

The Geometrical Effects of Bumps on the Fatigue Life of Flip-chip Packages by Taguchi Method

Wen-Ren Jong, Shia-Chung Chen, Hsin-Chun Tsai [...]

Journal of Reinforced Plastics and Composites

Select article: Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

Retricted access

Research article

First published 2005-12

Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

G. H. Wu, T. C. Tsein, S. H. Ju

Journal of Reinforced Plastics and Composites

Select article: Opinion: Chip scale packaged LEDs are far away from mass production

Retricted access

Research article

First published 2017-12

Opinion: Chip scale packaged LEDs are far away from mass production

Peng Ge

Lighting Research & Technology

1
2
3
•••
6
10 / page

Article type

Publication date

Subjects

Access