Mechanical strength of chip scale package with various underfills under accelerated thermal condition

Abstract

The bending strength of chip scale package (CSP) with various underfills was evaluated under thermal shock condition. The maximum bending strength and deflection of package decreased with increasing number of thermal shock cycles. The bending strength of package increased with increasing glass transition temperature T_g and damping property of the underfill, while the bending deflection decreased with increasing T_g and damping property of the underfill.