In the field of LED packaging, people usually pay more attention to colour temperature, luminous efficacy and colour rendering than colour tolerance. This paper focuses on how to meet strict colour tolerances in the process of chip-on-board packaging. The McAdam ellipses are used to explain the meaning of colour tolerance. A method based on adjusting the amount of phosphor glue and the proportions of different phosphors it contains is described. Measurements on samples packaged according to this method show that it makes it possible to meet strict colour tolerance requirements.
Get full access to this article
View all access options for this article.
References
1.
MacAdamDL. Visual sensitivities to color differences in daylight. Journal of the Optical Society of America1942; 32: 247–274.
2.
WoodM. Macadam’s ellipse and lights for the performing arts. Entertainment Technology2011; 11: 21–26.
3.
QiS-QDingS-DZhengPQinH-B. Research of the effect on the LED optical performance from COB packing. Electronics and Packaging2012; 12: 6–10.
4.
YuHShangJXuCLuoXLiuJZhangLLaiC. Chip-on-board (COB) wafer level packaging of LEDs using silicon substrates and chemical foaming process(CFP)-made glass-bubble caps. International Conference on Electronic Packaging Technology and High Density Packaging2011; 11: 133–136.
