SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Abstract

A silicon dioxide–copper (SiO₂-Cu) epoxy resin composite material for chip packaging was made by a mechanical mixing method with epoxy resin as the base glue and SiO₂ coated with nano-Cu (SiO₂-Cu) particles as the filler. The dispersion of SiO₂-Cu nanoparticles in epoxy resin was studied using scanning electron microscopy and transmission electron microscopy. Meanwhile, the effects of the filler on the coefficient of thermal conductivity, the coefficient of thermal expansion (CTE), and the mechanical properties of the composite material were also studied. The results show that SiO₂-Cu nanoparticles disperse well in the epoxy resin, the coefficient of thermal conductivity of SiO₂-Cu epoxy resin composites increases with an increase in the SiO₂-Cu filler amount, the coefficient of thermal conductivity begins to decline when the filling volume is over 25%, and the suitable amount of SiO₂-Cu is 25% of the total volume. With the increase in the filler, the CTE of the composite decreases; when the SiO₂-Cu filling amount is 25%, the material has good impact resistance and a long electromigration failure time for chip packaging materials.