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Articles (11)

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1-10 of 11 results for Ultrasonic soldering

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Select article: Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

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Research article

First published 2021-4

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

Select article: Ultrasonic soldering silica glass and 2024 alloy in low temperature

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Research article

First published 2022-8

Ultrasonic soldering silica glass and 2024 alloy in low temperature

Ruixiang Yi, Chao Chen, Haijun Li [...]

Science and Technology of Welding and Joining

Select article: Joining of 6061 aluminium ultrasonic soldered of Sn–Pb–Zn alloys

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Research article

First published 2013-3

Joining of 6061 aluminium ultrasonic soldered of Sn–Pb–Zn alloys

D Min

Materials Science and Technology

Select article: Ultrasonic-assisted fluxless reactive bonding of Mg/Al dissimilar alloy using Zn–Al solder in air

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Research article

First published 2018-1

Ultrasonic-assisted fluxless reactive bonding of Mg/Al dissimilar alloy using Zn–Al solder in air

Zhiwei Lai, Chuan Pan, Huiqiao Du [...]

Science and Technology of Welding and Joining

Select article: Investigation of microstructure evolution and mechanical properties of 2024 Al/Al 2 O 3 ceramic joints

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Research article

First published 2022-2

Investigation of microstructure evolution and mechanical properties of 2024 Al/Al 2 O 3 ceramic joints

Yuxiang Li, Chao Chen, Haijun Li [...]

Science and Technology of Welding and Joining

Select article: Experimental studies on application of silver paste in thermosonic flip-chip bonding

Open access

Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

Select article: Research on joining metal-ceramics composite Al/Al 2 O 3 with Cu substrate using solder type Zn–In–Mg

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Research article

First published 2019-5

Research on joining metal-ceramics composite Al/Al 2 O 3 with Cu substrate using solder type Zn–In–Mg

Roman Koleňák, Igor Kostolný, Jaromír Drápala [...]

Journal of Composite Materials

Select article: The Kinetics Study of Dissolving SnPb Solder by Hydrometallurgy

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Research article

First published 2019-09

The Kinetics Study of Dissolving SnPb Solder by Hydrometallurgy

Ping Zhu, Jiakang Tang, Qi Tao [...]

Environmental Engineering Science

Select article: Ultrasonic Active Fiber Sensor based on Pulse-echo Method

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Research article

First published 2009-06

Ultrasonic Active Fiber Sensor based on Pulse-echo Method

Seung-Hyun Lim, Il-Kwon Oh, Jung-Ryul Lee

Journal of Intelligent Material Systems and Structures

Select article: Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air

Open access

Research article

First published 2020-10

Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air

Yan Bi, Yong Nie, Qian Wang [...]

Advances in Mechanical Engineering

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