Low-temperature solder was used to join 2024 Al and Al2O3 ceramic by an ultrasonic-assisted soldering process. Strong bonding between solder alloy and Al2O3 ceramic could be obtained when the reactive wetting happened. Al2O3 was formed during the reactive wetting process, and it is supposed to determine the joining strength of 2024 Al/Al2O3 ceramic joints. The increase of product Al2O3 strengthened the bonding of solder and Al2O3 ceramic. To improve the mechanical behaviour of 2024 Al/Al2O3 ceramic joints, SHBF160 glass powder was added to solder to strengthen the bonding between solder and Al2O3. The shear strength of 2024 Al/Al2O3 ceramic joint increased to 69 MPa owing to the positive reinforcement of glass powder.
LiYX, ChenC, YiRX, Review: Special brazing and soldering. J Manuf Process. 2020; 60:608–635.
2.
YiRX, ChenC, ShiC, Research advances in residual thermal stress of ceramic/metal brazes. Ceram Int. 2021; 47(15):20807–20820.
3.
DezellusO, EustathopoulosN.Fundamental issues of reactive wetting by liquid metals. J Mater Sci. 2010; 45(16):4256–4264.
4.
SekulićDP.Advances in brazing: science, technology and applications. Elsevier. 2013;pp:330.
5.
KoleňákR, ŠeboP, ProvazníkM, Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics. Mater Des. 2011; 32(7):3997–4003.
6.
WuCML, YuDQ, LawCMT, Properties of lead-free solder alloys with rare earth element additions. Mater Sci Eng R Rep. 2004; 44(1):1–44.
7.
GremillardL, SaizE, RadmilovicVR, Role of titanium on the reactive spreading of lead-free solders on alumina. J Mater Res. 2006; 21(12):3222–3233.
8.
LiJG.Wetting of ceramic materials by liquid silicon, aluminium and metallic melts containing titanium and other reactive elements: a review. Ceram Int. 1994; 20(6):391–412.
9.
LeeK, GaoY, YaoZ-J, Tripeptide inhibitors of Yersinia protein-tyrosine phosphatase. Bioorg Med Chem Lett. 2003; 13(15):2577–2581.
10.
ChaiYH, WengWP, ChuangTH.Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al2O3 and SiC substrates. Ceram Int. 1998; 24(4):273–279.
11.
KoleňákR, ChachulaM, ŠeboP, Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics. Solder Surf Mount Technol. 2011; 23(4):224–228.
12.
XuY, MaXR, TangHY, Mechanism of the interfacial reaction between sapphire and Sn–3.5Ag–4Ti solder at a low temperature in air by ultrasound. Ceram Int. 2020; 46(4):4435–4443.
13.
LiZW, XuZW, MaL, Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics. Ultrason Sonochem. 2018 Dec; 49:249–259.
14.
LiZW, XuZW, MaL, Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part II: Cavitation erosion effect. Ultrason Sonochem. 2019 Jan; 50:278–288.
15.
KolenakR, KostolnyI, DrapalaJ, Characterizing the soldering alloy type Zn–Al–Cu and study of ultrasonic soldering of Al7075/Cu combination. Metals (Basel). 2021; 11(1):27.
16.
KolenakR, KostolnyI, DrapalaJ, Study of Zn6Al6Ag alloy application in ultrasonic soldering of Al2O3–(Al/Al2O3) joints. Metals (Basel). 2020; 10(3):343.
17.
KoleňákR, KostolnýI, DrápalaJ, Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn–In–Mg. J Compos Mater. 2019; 53(10):1411–1422.
18.
KoleňákR, KostolnýI, DrápalaJ, Research on soldering AlN ceramics with Cu substrate using Sn–Ag–Ti solder. Solder Surf Mount Technol. 2019; 31(2):93–101.
19.
XuY, MaXR, XiuZY, Bonding and strengthening mechanism on ultrasonic-assisted soldering of sapphire using Sn–3.5Ag–4Al solder. J Mater Process Technol. 2021; 288:1 8.
20.
CuiW, LiSQ, YanJC, Microstructure and mechanical performance of composite joints of sapphire by ultrasonic-assisted brazing. J Mater Process Technol. 2018; 257:1–6.
21.
El-DalyAA, DesokyWM, ElmosalamiTA, Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy. Mater Des (1980–2015). 2015; 65:1196–1204.
22.
CuiW, YanJC, DaiY, Building a nano-crystalline alpha-alumina layer at a liquid metal/sapphire interface by ultrasound. Ultrason Sonochem. 2015 Jan; 22:108–112.
VirotM, ChaveT, NikitenkoSI, Acoustic cavitation at the water−glass interface. J Phys Chem C. 2010; 114(30):13083–13091.
25.
ShchukinDG, SkorbE, BelovaV, Ultrasonic cavitation at solid surfaces. Adv Mater. 2011 May 3; 23(17):1922–1934.
26.
CuiW, WangCW, YanJC, Wetting and reaction promoted by ultrasound between sapphire and liquid Al–12Si alloy. Ultrason Sonochem. 2013 Jan; 20(1):196–201.
27.
GorjanL, BluganG, BoretiusM, Fracture behavior of soldered Al2O3 ceramic to A356 aluminum alloy and resistance of the joint to low temperature exposure. Mater Des. 2015; 88:889–896.
28.
NakaM, HafezKM.Applying of ultrasonic waves on brazing of alumina to copper using Zn–Al filler alloy. J Mater Sci. 2003; 38(16):3491–3494.
