The effects of ultrasonic-assisted soldering parameters on the interfacial microstructural evolution and shear strength of designed Al/Sn–9.77Zn–11.36Bi–1.46Ag/Cu solder joints were investigated. The ultrasonic-assisted soldering process promoted the dissolution of Al substrate and roughed Al/solder interface, which improved the pinning effect of Sn–9.77Zn–11.36Bi–1.46Ag on Al substrate. With an increasing ultrasonic soldering temperature, time and power, more Al atoms dissolved from Al substrate and migrated across solder to the opposite Cu substrate to form Al-rich (Zn) solid solutions. Consequently, Al4.2Cu3.2Zn0.7 formed between ϵ-AgZn3 and Cu5Zn8 layers at Cu substrate, resulting in thinner Cu5Zn8 and higher shear strength of solder joints. The highest shear strength of solder joints (38.6 MPa) was achieved after ultrasonic-assisted soldering at 300°C for 10 s under 9 W.
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