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Articles (14)

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1-10 of 14 results for Sn-rich solder

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Select article: Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

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Research article

First published 2021

Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

Zhao Zhang, Sheng Liu, Kun Ma [...]

International Journal of Damage Mechanics

Select article: Grain-Ripening of the Lead-Rich Phase in Partially Molten Pb-Sb-Sn and Pb-Sb-Sn-As Solders

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First published 1973-1

Grain-Ripening of the Lead-Rich Phase in Partially Molten Pb-Sb-Sn and Pb-Sb-Sn-As Solders

J. P. Sadocha, H. W. Kerr

Materials Science and Technology

Select article: Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

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Research article

First published 2022-10

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

Select article: Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

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Research article

First published 2005-6

Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

H. T. Lee, Y. H. Lee

Science and Technology of Welding and Joining

Select article: Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

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Research article

First published 2021-4

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

Select article: Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

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First published 2023-6

Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt-% NaCl solution

Xinyuan Yu, Huizhen Huang, Qinghuan Zhang [...]

Materials Science and Technology

Select article: Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

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Research article

First published 2008-7

Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

R. Mahmudi, A. R. Geranmayeh, H. Noori [...]

Materials Science and Technology

Select article: Void-free interface between in and high-impurity Cu joint

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First published 2023-12

Void-free interface between in and high-impurity Cu joint

Jia-Yi Lee, Yu-An Shen, Chih-Ming Chen

Science and Technology of Welding and Joining

Select article: Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

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First published 2018-10

Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

Tomasz Gancarz, Janusz Pstrus, Katarzyna Berent

Science and Technology of Welding and Joining

Select article: Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

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Research article

First published 2007-4

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

J.-W. Yoon, S.-W. Kim, S.-B. Jung

Materials Science and Technology

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