This work shows the effect on the soldering process of the addition of Ag and Cu to Sn–Zn alloys. Soldering of Al/Cu and Al/Al joints was performed for a time of 3 min, at a temperature of 250°C, with the use of flux. Aging was carried out at 170°C for Al/Cu and Al/Al joints for 1 and 10 days. During the aging process, intermetallic layers grew at the interface of the Al/Cu joint at the Cu substrate. Intermetallic layers were not observed during wetting of Al/Al joints. On the contrary, dissolution of the Al substrate and migration of Al-rich particles into the bulk of the solder were observed. The experiment was designed to demonstrate the effect of Ag and Cu addition on the dissolution of Al substrate during the soldering and aging processes. In the solder alloys, small precipitates of AgZn3 and Cu5Zn8 were observed.
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