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1-7 of 7 results for Sn-Cu-S solder

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Research article

First published 2021-12

On the advantages of Bi addition into Sn-Cu-S lead-free solder

Huizhen Huang, Qinghuan Zhang, Gewang Shuai [...]

Materials Science and Technology

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Research article

First published 2021-4

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

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Research article

First published 2005-1

Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

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Research article

First published 1985-3

Effect of compositional changes and impurities on wetting properties of eutectic Sn–Bi alloy used as solder

C. A. MacKay, W. D. von Voss

Materials Science and Technology

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Research article

First published 2022-5

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

K. Georgy, Sanjay Tikale, K. Narayan Prabhu

Materials Science and Technology

Open access

Research article

First published 2020-10

Microstructure and mechanical properties of Cu/Sn-In/Cu joints obtained by ultrasonic-assisted transient liquid phase bonding in air

Yan Bi, Yong Nie, Qian Wang [...]

Advances in Mechanical Engineering

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Research article

First published 2007-10

Formation of intermetallic compounds with Sn–Zn–Al solder on copper and electroless nickel–immersion gold substrates

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology