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Articles (23)

Journals (0)

1-10 of 23 results for SOLDER/SUBSTRATE INTERFACE

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Select article: Thermal contact at solder/substrate interfaces during solidification

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Research article

First published 2009-6

Thermal contact at solder/substrate interfaces during solidification

S. Nyamannavar, K. N. Prabhu

Materials Science and Technology

Select article: Wetting behaviour and interfacial microstructure of Sn–Ag–Zn solder alloys on nickel coated aluminium substrates

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Research article

First published 2011-7

Wetting behaviour and interfacial microstructure of Sn–Ag–Zn solder alloys on nickel coated aluminium substrates

Satyanarayan, K N Prabhu

Materials Science and Technology

Select article: Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu,Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

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Research article

First published 2013-4

Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu,Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

S Narayan, K N Prabhu

Materials Science and Technology

Select article: Investigation of interfacial bonding between Na 2 O–B 2 O 3 –SiO 2 solder and silicon carbide substrate

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Research article

First published 2011-10

Investigation of interfacial bonding between Na 2 O–B 2 O 3 –SiO 2 solder and silicon carbide substrate

Z H Luo, D L Jiang, J X Zhang [...]

Science and Technology of Welding and Joining

Select article: Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate

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Research article

First published 2003-8

Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate

J.-W. Yoon, C.-B. Lee, S.-B. Jung

Materials Science and Technology

Select article: Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate

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Research article

First published 2005-3

Kinetics of intermetallic compound layer growth and interfacial reactions between Sn–8Zn–5In solder and bare copper substrate

D.-G. Kim, H.-S. Jung, S.-B. Jung

Materials Science and Technology

Select article: Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

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Research article

First published 2021-4

Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

Select article: The behaviour of steel coated with TiB 2 in Sn-Ag-Cu melt

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Research article

First published 2019-4

The behaviour of steel coated with TiB 2 in Sn-Ag-Cu melt

Marton Benke, Zsolt Salyi, Viktor Takats [...]

Materials Science and Technology

Select article: Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

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Research article

First published 2018-10

Interfacial reactions of Sn–Zn–Ag–Cu alloy on soldered Al/Cu and Al/Al joints

Tomasz Gancarz, Janusz Pstrus, Katarzyna Berent

Science and Technology of Welding and Joining

Select article: Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

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Research article

First published 2022-5

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

K. Georgy, Sanjay Tikale, K. Narayan Prabhu

Materials Science and Technology

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