Electromagnetic shielding performance has been achieved for a polyimide (PI)-matrix composite by the strategy of self-metallization of its thermosetting PI matrix. Self-metallization of the thermosetting PI was realized by silver ion/poly(amic acid) (PAA) precursor ion exchange and thermal reduction. The factors influencing the self-metallization were investigated. The electrical conductivity and integrity for the surface of the PI were achieved by optimization of ion exchange/thermal reduction parameters. The fabricated PI-matrix composite exhibits a maximum electromagnetic interference shielding effectiveness value of 81 dB. Importantly, the electromagnetic shielding performance can be maintained even after heat condition of 300°C. Meanwhile, the surface-metallized PI composite exhibits mechanical property equivalent to the pristine composite, and an Ag/matrix interfacial strength higher than 19.6 MPa. Besides, self-metallization mechanism of the thermosetting PI was investigated.
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