In nanosoldering, the wettability of nanosolder is a key factor to gauge the contacts’ firmness. Here, a novel in situ wetting measurement method by using electron beam irradiation in transmission electron microscopy has been proposed, which has the crucial advantages of dynamically observing the wetting process between nanosolder and nanomaterial to be soldered, rapidly measuring the contact angle, and greatly avoiding the complex procedures in traditional method. The experimental tests show that the contact angle of a reflowed 97Sn3Cu nanosolder drop on a WO3 nanowire obtained by the new method is consistent with that obtained by the traditional method. This novel wetting measurement method is aimed at promoting the application of nanosolders in nanosoldering.
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