Nanosoldering is a way of bottom-up manufacturing that can establish close, strong contact between individual nanoobjects. The reflow of nanosolder plays a vital role in achieving such reliable contact. Here, we propose an in situ reflow approach that uses Joule heating induced by electrical current flowing through the nanosolder as a heating source in scanning electron microscopy. This method facilitated the reflow of 97Sn3Cu nanosolder at approximately 2.9 μJ of Joule heat, without requiring flux. Additionally, we have performed other reflow approaches for reflow tests of 97Sn3Cu nanosolder. This paper eager to provide valuable approaches for nanosolders reflow, aiming at enhancing their application in nanosoldering.
LiddleJAGallatinGM. Nanomanufacturing: a perspective. ACS Nano2016; 10: 2995–3014.
2.
MahamoodRMAkinlabiET. Advanced noncontact cutting and joining technologies. Cham: Springer, 2018.
3.
JacksonMJ. Micro-and nanomanufacturing. New York: Springer, 2007.
4.
HuA. Laser micro-nano-manufacturing and 3D microprinting. Berlin/Heidelberg: Springer, 2020.
5.
SinghSKumarABehuraSK, et al.Challenges and opportunities in nanomanufacturing. Nanomanuf Nanomater Des2022: 17–30. doi:https://doi.org/10.1201/9781003220602-2.
6.
LiPKangZRaoF, et al.Nanowelding in whole-lifetime bottom-up manufacturing: from assembly to service. Small Methods2021; 5: 2100654.
7.
AllainAKangJBanerjeeK, et al.Electrical contacts to two-dimensional semiconductors. Nat Mater2015; 14: 1195–1205.
8.
CuiQGaoFMukherjeeS, et al.Joining and interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems. Small2009; 5: 1246–1257.
9.
PengYCullisTInksonB. Bottom-up nanoconstruction by the welding of individual metallic nanoobjects using nanoscale solder. Nano Lett2009; 9: 91–96.
10.
XuSTianMWangJ, et al.Nanometer-scale modification and welding of silicon and metallic nanowires with a high-intensity electron beam. Small2005; 1: 1221–1229.
11.
LiMXieXXuY, et al.External field-strengthened Ostwald nanowelding. Nano Res2022; 15: 4525–4535.
12.
SchauermanCMAlvarengaJStaubJ, et al.Ultrasonic welding of bulk carbon nanotube conductors. Adv Eng Mater2015; 17: 76–83.
13.
ShenPCSuCLinY, et al.Ultralow contact resistance between semimetal and monolayer semiconductors. Nature2021; 593: 211–217.
14.
RazaviehAZeitzoffPNowakEJ. Challenges and limitations of CMOS scaling for FinFET and beyond architectures. IEEE T Nanotechnol2019; 18: 999–1004.
15.
SchwambTBurgBRSchirmerNC, et al.On the effect of the electrical contact resistance in nanodevices. Appl Phys Lett2008; 92: 243106.
16.
GuoYSunYTangA, et al.Field-effect at electrical contacts to two-dimensional materials. Nano Res2021; 14: 4894–4900.
17.
LiQChenZYZhangX, et al.Au80Sn20-based targeted noncontact nanosoldering with low power consumption. Opt Lett2018; 43: 4989–4992.
18.
ZhangXZhengXZhangH, et al.Bottom-up nanoarchitectures of semiconductor nano-building blocks obtained via a controllable in situ SEM-FIB thermal soldering method. J Mater Chem C2017; 5: 8707–8713.
19.
QuKZhangHLanQ, et al.Realization of the welding of individual TiO2 semiconductor nano-objects using a novel 1D Au80Sn20 nanosolder. J Mater Chem C2015; 3: 11311–11317.
20.
HuangYTianYHangC, et al.Self-limited nanosoldering of silver nanowires for high-performance flexible transparent heaters. ACS Appl Mater Interfaces2019; 11: 21850–21858.
21.
GaoFRajathuraiKCuiQ, et al.Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods. Appl Surf Sci2012; 258: 7507–7514.
22.
ShuYRajathuraiKGaoF, et al.Synthesis and thermal properties of low melting temperature tin/indium (Sn/In) lead-free nanosolders and their melting behavior in a vapor flux. J Alloy Compd2015; 626: 391–400.
23.
JiangHMoonKSHuaF, et al.Synthesis and thermal and wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders. Chem Mater2007; 19: 4482–4485.
24.
AtalayFAvsarDKayaH, et al.Nanowires of lead-free solder alloy SnCuAg. J Nanomater2011; 2011: 1–6.
25.
ZhangXZhangHZhengX, et al.A novel 96.5Sn3Cu0.5Mn nanosolder with enhanced wettability applied to nanosoldering of WO3 nanomaterial. Nanotechnology2019; 30: 195302.
26.
SalamBVirsedaCDaH, et al.Reflow profile study of the Sn-Ag-Cu solder. Solder Surf Mt Tech2004; 16: 27–34.
SuppiahSOngNRSauliZ, et al.A review on solder reflow and flux application for flip chip. AIP Conf Proc2017; 1885: 020264.
29.
SmithBATurbiniLJ. Characterizing the weak organic acids used in low solids fluxes. J Electron Mater1999; 28: 1299–1306.
30.
GuZYeHSmirnovaD, et al.Reflow and electrical characteristics of nanoscale solder. Small2006; 2: 225–229.
31.
ZhangXZhangW. Rapid in situ wetting measurement for nanosolder by electron beam irradiation. Sci Technol Weld Joi2023; 28: 298–304.
32.
ZhangXZhangWPengY. In situ investigation on melting characteristics of 1D SnCu alloy nanosolder. Nanotechnology2022; 33: 305301.
33.
TongZLuoX. Investigation of focused ion beam induced damage in single crystal diamond tools. Appl Surf Sci2015; 347: 727–735.
34.
SiemonsWBeekmanCFowlkesJ, et al.Focused-ion-beam induced damage in thin films of complex oxide BiFeO3. APL Mater2014; 2: 022109.
35.
YokotaTMurayamaMHoweJ. In situ transmission-electron-microscopy investigation of melting in submicron Al-Si alloy particles under electron-beam irradiation. Phys Rev Lett2003; 91: 265504.
36.
LereahYKofmanRPenissonJ, et al.Time-resolved electron microscopy studies of the structure of nanoparticles and their melting. Philos Mag B2001; 81: 1801–1819.
37.
KamalMMeikhailMEl-bediwiAB, et al.Structure, electrical, mechanical and wettability of quenched lead-free solder alloys. Radiat Eff Defect S2005; 160: 37–44.
38.
YinQGaoFWangJ, et al.Length-dependent melting behavior of Sn nanowires. J Mater Res2017; 32: 1194–1202.
39.
VolkertCAMinorAM. Focused ion beam microscopy and micromachining. MRS Bull2007; 32: 389–399.
40.
BassimNScottKGiannuzziLA. Recent advances in focused ion beam technology and applications. MRS Bull2014; 39: 317–325.
41.
AjayanPMarksL. Quasimelting and phases of small particles. Phys Rev Lett1988; 60: 585–587.
42.
VoorheesPW. The theory of Ostwald ripening. J Stat Phys1985; 38: 231–252.
