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Research article

First published 2013-8

Integrating the Taguchi method and the multiattribute decision-making method to optimize the surface mount technology solder paste printing thickness process

Shen-Tsu Wang

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2016-12

Complex evaluation and development of electrolytic tin refining in acidic chloride media for processing tin-based scrap from lead-free soldering

T. Kulcsar, G. B. Toth, T. Kekesi

Mineral Processing and Extractive Metallurgy: Transactions of the Institutions of Mining and Metallurgy

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Research article

First published 2008-2

Evaluating a new flexible soldering system for electronics small and medium enterprises

R P Monfared, A A West, D A Vera [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2006-11

Measurement of deflections experienced by electronic chips during soldering

C A Sciammarella, L Lamberti, C Pappalettere [...]

The Journal of Strain Analysis for Engineering Design

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Research article

First published 1992-10

Reaction processes between silver or zinc doped Pb–Sn solder and gold

C. R Hall, EI.-B. Hannech

Materials Science and Technology

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Research article

First published 1984-1

Soldering technology — decade of developments

C. J. Thwaites

International Materials Reviews

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Research article

First published 2007-9

Study on oxygen contamination during atomisation of solder powders for microelectronics

R. C. Reddy, B. S. Kiran, V. C. Sethi [...]

Powder Metallurgy

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Research article

First published 1999-7

Influence of solder thickness on interfacial structures and fatigue properties of Cu/Sn/Cu joints

H. Kato, S. Horikawa, K. Kageyama

Materials Science and Technology

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Research article

First published 2011-11

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Z Zeng, X B Li, L Li [...]

Materials Science and Technology

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Research article

First published 2013-3

Joining of 6061 aluminium ultrasonic soldered of Sn–Pb–Zn alloys

D Min

Materials Science and Technology

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