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Research article

First published 2021

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin [...]

Nanomaterials and Nanotechnology

Open access

Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

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Research article

First published 2026

Investigation on microstructure evolution and mechanical reliability of Sn-Ni high-temperature resistant solder joints fabricated through microwave hybrid heating

Shuye Zhang, Shuai Zhang, Changhao Lin [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 1979-03

Studies on Microstructure of Gold Soldered Joints

Tetsuo Saito, Jose Fortunato F. Santos

Journal of Dental Research

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Research article

First published 2014-3

Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

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Research article

First published 2007-7

Factors influencing current density distribution and current crowding in flip chip solder joints

C. Yu, H. Lu, R. Z. Fan [...]

Science and Technology of Welding and Joining

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Research article

First published 2012-7

Properties of SnZn lead free solders bearing rare earth Y

L Zhang, J-G Han, Y-H Guo [...]

Science and Technology of Welding and Joining

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Research article

First published 2008-4

Using carbon nanotubes to enhance creep performance of lead free solder

S. M. L. Nai, J. Wei, M. Gupta

Materials Science and Technology

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Research article

First published 2013-11

Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study

Wei Yao, Cemal Basaran

International Journal of Damage Mechanics

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Research article

First published 2009-11

Thermomechanical behaviour of environmentally benign Pb-free solders

N Chawla

International Materials Reviews

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