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Research article

First published 2023-9

Ultrasonic inspection during autoclave cure of reflowable-interface composite joints

Tyler B Hudson, Fatimata Baro, Austin J Smith [...]

Journal of Composite Materials

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Research article

First published 2026-3

Co-bonding of aerospace composite joints with reflowable adherend interfaces

Tyler B. Hudson, Nicholas A. Georgiou, Austin J. Smith [...]

Journal of Composite Materials

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Research article

First published 2006-1

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global–local finite element model

K-C Chang, K-N Chiang

The Journal of Strain Analysis for Engineering Design

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Research article

First published 2022-5

Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions

K. Georgy, Sanjay Tikale, K. Narayan Prabhu

Materials Science and Technology

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Research article

First published 2009-12

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

J.-W. Yoon, S.-B. Jung

Materials Science and Technology

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Research article

First published 2012-7

Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips

M L Huang, J L Pan, H T Ma [...]

Materials Science and Technology

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Research article

First published 2007-4

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

J.-W. Yoon, S.-W. Kim, S.-B. Jung

Materials Science and Technology

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Research article

First published 2004-9

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

K-C Chang, M-K Yeh, K-N Chiang

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2008-10

Microstructure transformation of Sn base solders under isothermal aging and thermal shearing cycling conditions

L. H. Qi, J. H. Huang, X. K. Zhao [...]

Materials Science and Technology

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Research article

First published 2010-5

Effect of Mn on Sn–Ag–Cu ternary lead free solder alloy–Cu assembly: A comparative study

M. Ghosh, M. K. Gunjan, S. K. Das [...]

Materials Science and Technology

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