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Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

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Research article

First published 2025-11

Design of optical–electrical hybrid switching mechanism for array processors

Bowen Yang, Jinyang Huang, Rui Shan [...]

Journal of Computational Methods in Sciences and Engineering

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Research article

First published 2018-2

Multi-culture diversity based self adaptive particle swarm optimization for optimal floorplanning

S.B. Vinay Kumar, P.V. Rao, Manoj Kumar Singh

Multiagent and Grid Systems

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Research article

First published 1998-09

Stacking Technology for a Space Constrained Microsystem

M. Heschel, J. F. Kuhmann, S. Bouwstra [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2007-5

High performance architectures for Chip-to-Chip Communications on Network Line Cards

Jacob Engel, Taskin Kocak

Journal of High Speed Networks

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Research article

First published 2000-6

“Microflex”—A New Assembling Technique for Interconnects

Thomas Stieglitz, Hansjoerg Beutel, J. -Uwe Meyer

Journal of Intelligent Material Systems and Structures

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Research article

First published 2006-5

Synchroscalar: Evaluation of an embedded,multi-core architecture for media applications

John Oliver, Ravishankar Rao, Diana Franklin [...]

Journal of Embedded Computing

Open access

Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

Free access

Research article

First published 1993-5

Making Circuits More than Once: The Manufacturing Challenges of Electronics Intensive Products

D J Williams, P P Conway, D C Whalley

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2011-5

Optimization of reconfigurable multi-core system-on-chips for multi-standard applications

Ali Ahmadinia, Hernando Fernandez-Canque

International Journal of Knowledge-Based and Intelligent Engineering Systems

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