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Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

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Research article

First published 2010-8

Preparation and Properties of Glass Cloth-reinforced Meltable Thermoplastic Polyimide Composites for Microelectronic Packaging Substrates

Hongyan Xu, Haixia Yang, Liming Tao [...]

High Performance Polymers

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Research article

First published 2018-3

Design and characteristic analysis of an aerostatic decoupling table for microelectronic packaging

Cunman Liang, Fujun Wang, Qingguo Yang [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2020-3

Design and experiment of a jetting dispenser with compact amplifying mechanism and low stress in piezostack

Lingyun Wang, Xiang Huang, Siying Lin [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2002-01

Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronics Packaging

Cemal Basaran, Hong Tang

International Journal of Damage Mechanics

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Research article

First published 2017-11

Interfacial reaction during fabricating of full Cu 3 Sn joints in microelectronic packaging

Xiaobo Liang, Xiaoyan Li, Peng Yao [...]

Materials Science and Technology

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Research article

First published 2004-2

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Naoki Muraki, Nobuhiro Matoba, Takayuki Hirano [...]

Applied Spectroscopy

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Research article

First published 2013-9

Iodide based polyamide stabilisers as potential risk for corrosion in electronics

M. Leineweber, L. Müller

Corrosion Engineering,Science and Technology: The International Journal of Corrosion Processes and Corrosion Control

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Research article

First published 1993-05

On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound

L.S. Turng, V.W. Wang

Journal of Reinforced Plastics and Composites

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Research article

First published 1993-06

Sorption of methylene chloride vapor in polyimide films

Christopher R Moylan, Christopher P Wade, Sally A Swanson [...]

High Performance Polymers

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