Sage Journals: Discover world-class research

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Research article

First published 2006-11

Measurement of deflections experienced by electronic chips during soldering

C A Sciammarella, L Lamberti, C Pappalettere [...]

The Journal of Strain Analysis for Engineering Design

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Research article

First published 2017-08

Tagging of Test Tubes with Electronic p-Chips for Use in Biorepositories

Wlodek Mandecki, Wesley M. Kopacka, Ziye Qian [...]

Biopreservation and Biobanking

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Research article

First published 2021-02-02

Application of single chip technology in internet of things electronic products

Lingxue Zhang, Haitao Wu

Journal of Intelligent & Fuzzy Systems: Applications in Engineering and Technology

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Research article

First published 1997-5

Silicon Drift Detectors with On-Chip Electronics for X-Ray Spectroscopy

C. Fiorini, A. Longoni, R. Hartmann [...]

Journal of X-Ray Science and Technology

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Product review

First published 2007-7

Challenging the Chip: Labor Rights and Environmental Justice in the Global Electronics Industry

Seán ó Riain

Contemporary Sociology: A Journal of Reviews

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Research article

First published 2024

Comprehensive investigation of optimal vortex generator shape and position for heat transfer enhancement in a rectangular passage to cool electronic appliances: A numerical analysis

Jaideep Shukla, Pushpendra Kumar Shukla, Prashant Kumar Jangde

Proceedings of the Institution of Mechanical Engineers,Part E: Journal of Process Mechanical Engineering

Free access

Research article

First published 2019-3

Modeling of burr thickness in micro-end milling of Ti6Al4V

Vipindas Kizhakken, Jose Mathew

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2016-5

On-Chip Micro–Electro–Mechanical System Fourier Transform Infrared (MEMS FT-IR) Spectrometer-Based Gas Sensing

Mazen Erfan, Yasser M Sabry, Mohammad Sakr [...]

Applied Spectroscopy

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Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

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Research article

First published 2014-3

Investigation on the chip formation concerning tool inclination angles in ball end milling of H13 die steel

Xiaoxiao Chen, Jun Zhao, Shuai Liu [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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