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Research article

First published 2026-3

Influence of deposition voltage on hydroxyapatite–chitosan coatings on Ti6Al4V

Rakesh Pani, Rasmi Ranjan Behera, Sudesna Roy

Surface Engineering

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Research article

First published 2003-2

Influence of Bias Voltage on Copper Nitride Films Deposited by Reactive Sputtering

J. F. Pierson

Surface Engineering

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Research article

First published 2015-2

Structural and tribological properties of TiC-DLC coatings deposited by RCAE-PVD at various bias voltages

M. J. Mosayebi, S. R. Hosseini

Surface Engineering

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Research article

First published 2023-4

Effect of bias voltages on microstructure and mechanical properties of (AlCrNbSiTi)N high entropy alloy nitride coatings deposited by arc ion plating

Jie Liu, Xiangyu Zhang, Xiaomei Zeng [...]

Surface Engineering

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Research article

First published 2015-12

Concentration Determination of Copper in Aqueous Solution Using Deposition-Assisted Laser-Induced Breakdown Spectroscopy (LIBS)

Yuan Lu, Ying Li, Fujun Qi [...]

Applied Spectroscopy

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Research article

First published 2020-5

Comparison of the effect of arched and through magnetic field configurations in cathodic arc deposition

Jalal Shiravi Khoozani, Seyed Hojjatollah Hosseini, Mohammadreza Ebrahimi Fordoei

Surface Engineering

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Research article

First published 2020-1

Effect of high-voltage pulse bias on the stress and morphology of CA-PVD TiN coatings

Golnaz Taghavi Pourian Azar, Mustafa Ürgen

Surface Engineering

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Research article

First published 1973-05

A New Electrochemical Process for the Fabrication of Nonwoven Materials

R.D. Bankert, E.A. Battistelli, T.B. Reddy

Textile Research Journal

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Research article

First published 2014-5

Experimental investigations into ultrasonic-assisted jet electrodeposition process

Mridul S Rajput, Pulak M Pandey, Sunil Jha

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2017-8

Bias effects on AlMgB thin films prepared by magnetron sputtering

S. Jing, Y. Bai, F. Qin [...]

Surface Engineering

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