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Open access

Research article

First published 2021-5

Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding

Wuwei Feng, Xin Chen, Cuizhu Wang [...]

International Journal of Distributed Sensor Networks

Open access

Research article

First published 2013-2

Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding

M Maeda, S Kitamori, Y Takahashi

Science and Technology of Welding and Joining

Retricted access

Research article

First published 2003-3

Dynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging

C M Hu, N Guo, H Du [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

Retricted access

Research article

First published 2007-8

Vibration characteristics of the capillary in ultrasonic wire bonders

C M Hu, N Q Guo, H J Du [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

Retricted access

Research article

First published 2025-2

Exploring the impact of wire core diameter on microstructure and joint properties in ultrasonic wire harness welding

Yongqi Zhang, Lun Zhao, Zhonghua Shen [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

Free access

Research article

First published 2024-1

Fabrication and characterization of copper and copper alloys reinforced with graphene

Antoine Bident, Florence Delange, Christine Labrugere [...]

Journal of Composite Materials

Retricted access

Review article

First published 2023-1

Post-processing treatments–microstructure–performance interrelationship of metal additive manufactured aerospace alloys: A review

Olatunji Oladimeji Ojo, Emel Taban

Materials Science and Technology

Search results

Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding

Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding

Dynamic characteristics of stacked piezoelectric transducers of ultrasonic wire bonders used in integrated circuit packaging

Vibration characteristics of the capillary in ultrasonic wire bonders

Exploring the impact of wire core diameter on microstructure and joint properties in ultrasonic wire harness welding

Fabrication and characterization of copper and copper alloys reinforced with graphene

Post-processing treatments–microstructure–performance interrelationship of metal additive manufactured aerospace alloys: A review