Sage Journals: Discover world-class research

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Research article

First published 2012-11

A new technology for recycling solder from waste printed circuit boards using ionic liquid

Ping Zhu, Yan Chen, Liang you Wang [...]

Waste Management & Research: The Journal for a Sustainable Circular Economy

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Research article

First published 2019-08

Mechanism of Dissolving Tin Solders from Waste Printed Circuit Board Assemblies by Cyclic Fluoboric Acid Composite System

Zhu Ping, Xiankai Liu, Qi Tao [...]

Environmental Engineering Science

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Research article

First published 2016-12

Complex evaluation and development of electrolytic tin refining in acidic chloride media for processing tin-based scrap from lead-free soldering

T. Kulcsar, G. B. Toth, T. Kekesi

Mineral Processing and Extractive Metallurgy: Transactions of the Institutions of Mining and Metallurgy

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Research article

First published 2023-5

Effects of work-hardening and post thermal-treatment on tensile behaviour of solder-affected copper

M Muzibur Rahman, S Reaz Ahmed

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2022-2

Structure analysis of the conical heating hole for waste printed circuit boards disassembly

Fengfu Yin, Tianhao Chang, Lin Li [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2019-09

The Kinetics Study of Dissolving SnPb Solder by Hydrometallurgy

Ping Zhu, Jiakang Tang, Qi Tao [...]

Environmental Engineering Science

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Research article

First published 2020

An intelligent approach for improving printed circuit board assembly process performance in smart manufacturing

Vincent WC Fung, Kam Chuen Yung

International Journal of Engineering Business Management

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Research article

First published 2018-2

Using improved simulated anneal arithmetic to improve semiconductor packaging ball placement process capability

Shen-Tsu Wang, Meng-Hua Li

Advances in Mechanical Engineering

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Research article

First published 2026-3

Automated Seamless Poly(ε-Caprolactone) Electrospun Tubes for Critically-Sized Bone Defect Repair

Kelly L. O’Neill, Kylie E. Williams, Auveen Hajarizadeh [...]

Tissue Engineering Part C: Methods

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