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Articles (75)

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1-10 of 75 results for Sn–Bi

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Select article: Formation of microstructure resulting from quasi-peritectic reactions during freezing of Bi–Pb–Sn and Cu–Ni–Sn ternary alloys

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Research article

First published 2008-2

Formation of microstructure resulting from quasi-peritectic reactions during freezing of Bi–Pb–Sn and Cu–Ni–Sn ternary alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Microstructural modification of Sn–Bi and Sn–Bi–Al immiscible alloys by shearing

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Research article

First published 2019-12

Microstructural modification of Sn–Bi and Sn–Bi–Al immiscible alloys by shearing

Z. Cassinath, Z. Li, S. Sridhar [...]

Materials Science and Technology

Select article: Microstructure of Bi–Cd–Sn ternary eutectic

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Research article

First published 1992-6

Microstructure of Bi–Cd–Sn ternary eutectic

M. A Ruggiero, J. W. Rutter

Materials Science and Technology

Select article: Origin of microstructure in Bi–Pb and Bi–Sn binary eutectics

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Research article

First published 1997-7

Origin of microstructure in Bi–Pb and Bi–Sn binary eutectics

S. D. Bagheri, J. W. Rutter

Materials Science and Technology

Select article: High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling 1

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Research article

First published 2022-10

High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling 1

Chih-han Yang, Yu-chen Liu, Yuki Hirata [...]

Science and Technology of Welding and Joining

Select article: Phase relationships in Bi–In–Sn alloy system

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Research article

First published 1986-10

Phase relationships in Bi–In–Sn alloy system

H. Kabassis, J. W. Rutter, W. C. Winegard

Materials Science and Technology

Select article: Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

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Research article

First published 2014-4

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

A. F. Abd El-Rehim, H. Y. Zahran

Materials Science and Technology

Select article: Origin of microstructure in 350 K eutectic of Bi–In–Sn ternary system

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Research article

First published 1995-2

Origin of microstructure in 350 K eutectic of Bi–In–Sn ternary system

M. A. Ruggiero, J. W. Rutter

Materials Science and Technology

Select article: Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

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Research article

First published 2016-8

Interrelation of wettability–microstructure–tensile strength of lead-free Sn–Ag and Sn–Bi solder alloys

Wislei R. Osório, Amauri Garcia

Science and Technology of Welding and Joining

Select article: On the advantages of Bi addition into Sn-Cu-S lead-free solder

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Research article

First published 2021-12

On the advantages of Bi addition into Sn-Cu-S lead-free solder

Huizhen Huang, Qinghuan Zhang, Gewang Shuai [...]

Materials Science and Technology

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