A comparative investigation on the wettability and tensile strength of a Sn–2Ag, a Sn–40Bi and the traditional eutectic Sn–Pb solder alloys was carried out. The wettability is represented by thickness of covered layer (TCL) and spread area (SA) while the mechanical behaviour by the ultimate tensile strength (UTS). It is shown that the TCL of studied alloys decreased with the increase in the dipping temperature. It is also shown that TCL and SA have opposite behaviour with respect to the cooling rate. The Sn–Bi solder alloy has lower SA when compared with those of the Sn–Ag solder when similar cooling rates are considered. The Sn–Bi solder exhibits the best UTS/SA combination for dendritic spacings between 25 and 27 µm, associated with cooling rates ∼2°C s−1, 2× lower than those of the Sn–Ag alloy. Besides, the Sn–Bi alloy has shown SA >70∼80% associated with higher UTS (∼80 MPa) as compared with the other alloys examined.
YuS. P., LinH. J. and HonM. H.: ‘Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate’, J. Mater. Sci. Mater. Electron., 2000, 11, 461–471. doi: 10.1023/A:1008960316695
2.
SuganumaK.: ‘Advances in lead-free electronics soldering’, Solid State Mater. Sci., 2001, 5, 55–64. doi: 10.1016/S1359-0286(00)00036-X
3.
SuganumaK. and KimK. S.: ‘Sn-Zn low temperature solder’, J. Mater. Sci.: Mater. Electron, 2007, 18, 121–127.
4.
IslamR. A., ChanY. C., JillekW. and IslamS.: ‘Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders’, Microelectron. J., 2006, 37, 705–713. doi: 10.1016/j.mejo.2005.12.010
5.
ChenX., LiM., RenX. X., HuA. M. and MaoD. L.: ‘Effect of small additions of alloying elements on the properties of Sn-Zn eutectic alloy’, J. Electron. Mater., 2006, 35, 1734–1739. doi: 10.1007/s11664-006-0227-5
6.
WeiC., LiuY. C., HanY. J., WanJ. B. and YangK.: ‘Microstructures of eutectic Sn-Ag-Zn solder solidified with different cooling rates’, J. Alloys Comp., 2008, 464, 301–305. doi: 10.1016/j.jallcom.2007.09.103
7.
OsórioW. R., GarciaL. R., PeixotoL. C. and GarciaA.: ‘Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array’, Mater. Des., 2011, 32, 4763–4772. doi: 10.1016/j.matdes.2011.06.032
8.
OsórioW. R., PeixotoL. C., GarciaL. R., Mangelinck-NoëlN. and GarciaA.: ‘Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys’, J. Alloys Comp., 2013, 572, 97–106. doi: 10.1016/j.jallcom.2013.03.234
9.
OsórioW. R., LeivaD. R., PeixotoL. C., GarciaL. R. and GarciaA.: ‘Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology’, J. Alloys Comp., 2013, 562, 194–204. doi: 10.1016/j.jallcom.2013.02.050
10.
LiuJ. C., ParkS. W., NagaoS., NogiM., KogaH., MaJ. S., ZhangG. and SuganumaK.: ‘The role of Zn precipitates and Cl anions in pitting corrosion of Sn–Zn solder alloys’. Corr. Sci., 2014, 92, 263–271. doi: 10.1016/j.corsci.2014.12.014
11.
McCormackM., JinS., KammlottG. W. and ChenH. S.: ‘New Pb-free solder alloy with superior mechanical properties’, Appl. Phys. Lett., 1993, 63, 15–17. doi: 10.1063/1.109734
12.
MillerC. M., AndersonI. E. and SmithJ. F.: ‘A viable tin-lead solder substitute: Sn-Ag-Cu’, J. Electron. Mater., 1994, 23, 595–601. doi: 10.1007/BF02653344
13.
McCormackM. and JinS.: ‘New, lead-free solders’, J. Electron Mater., 1994, 23, 635–640. doi: 10.1007/BF02653349
14.
ShohjiI., GaggC. and PlumbridgeW. J.: ‘Creep properties of Sn-8Mass%Zn-3Mass%Bi lead-free alloy’, J. Electron. Mater., 2004, 33, 923–927. doi: 10.1007/s11664-004-0222-7
15.
SharifA. and ChanY. C.: ‘Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints’, Microelectron. Eng., 2007, 84, 328–335. doi: 10.1016/j.mee.2006.10.087
16.
GarciaL. R., OsórioW. R., PeixotoL. C. and GarciaA.: ‘Wetting behavior and mechanical properties of Sn-Zn and Sn-Pb solder alloys’, J. Electron. Mater., 2009, 38, 2405–2414. doi: 10.1007/s11664-009-0888-y
17.
MadeniJ., LiuS. and SiewertT.: ‘2nd International Brazing and Soldering Conference (ISBC)’, San Diego, California, February 2003, 17–19.
18.
XingF. and QiuF.: ‘Thermal properties, electrochemical behaviour and microstructure of Zn-5Sn-2Cu-1.5Bi high-temperature solder’, J. Mater. Eng. Perform., 2015, 24, 1679–1686. doi: 10.1007/s11665-015-1416-2
19.
WangH., GaoZ., LiuY., LiC., MaZ. and YuL.: ‘Evaluation of cooling rate on electrochemical behavior of Sn-0.3Ag-0.9Zn solder alloy in 3.5wt-% NaCl solution’, J. Mater. Sci.: Mater. Electron., 2015, 26, 11–22.
20.
SuganumaK., NiiharaK., ShoutokuT. and NakamuraY.: ‘Wetting and interface microstructure between Sn–Zn binary alloys and Cu’, J. Mater. Res., 1998, 13, 2859–2865. doi: 10.1557/JMR.1998.0391
21.
WeiX., HuangH., ZhouL., ZhangM. and LiuX.: ‘On the advantages of using a hypoeutectic Sn–Zn as lead-free solder material’, Mater. Lett., 2007, 61, 655–658. doi: 10.1016/j.matlet.2006.05.029
22.
SantosC. A., QuaresmaJ. M. V. and GarciaA.: ‘Determination of trasient interfacial heat transfer coefficients in chill mold castings’, J. Alloys Comp., 2001, 319, 174–186. doi: 10.1016/S0925-8388(01)00904-5
23.
ToyeT. C. and JonesE. R.: ‘Physical properties of certain liquid binary alloys of Tin and Zinc’, Proc. Phys. Soc., 1958, 71, 88–99. doi: 10.1088/0370-1328/71/1/313
24.
LeeL. M. and MohamadA. A.: ‘Interfacial reaction of Sn-Ag-Cu Lead-Free solder alloy on Cu: a review’, Adv. Mater Sci Eng., 2013. doi:10.1155/2013/123697.
25.
SuT. L., TsaoL. C., ChangS. Y. and ChuangT. H.: ‘Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag Substrate’, J. Mater. Eng. Perform., 2002, 11, 365–368. doi: 10.1361/105994902770343872
26.
ZhaoH., WangH. Q., SekulicD. P. and QianY. Y.: ‘Spreading kinetics of liquid solders over an intermetallic solid surface. Part 2: Lead-free solders’, J. Electron Mater., 2009, 38, 1846–1854. doi: 10.1007/s11664-009-0870-8
27.
NogitaK.: ‘Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys’, Intermetallics, 2010, 18, 145–149. doi: 10.1016/j.intermet.2009.07.005
28.
TsukamotoH., NishimuraT., SuenagaS., McDonaldS. D., SweatmanK. W. and NogitaK.: ‘The influence of solder composition on the impact strength of lead-free solder ball grid array joints’, Microelectron. Reliab., 2011, 51, 657–667. doi: 10.1016/j.microrel.2010.10.012
29.
BiJ., HuA., HuJ., LuoT., LiM. and MaoM.: ‘Effect of Cr additions on interfacial reaction between the Sn–Zn–Bi solder and Cu/electroplated Ni substrates’, Microelectron. Reliab., 2011, 51, 636–641. doi: 10.1016/j.microrel.2010.09.028
