Low-temperature Pb-free solders are in demand in the electronic industry for reducing processing emissions and enhancing product reliability. Sn–Bi-based alloys have drawn great interests. We performed high-throughput CALculation of PHAse Diagram modelling and systematically screened 35,343 alloy compositions among the Sn–Bi–Ag–In and Sn–Bi–Ag–Zn quaternary systems. An optimal alloy of each system was proposed, experimentally characterised based on microstructural, thermal, and mechanical analyses, and their phase equilibria and solidification reactions are elaborated. The designed Sn–Bi–Ag–In alloy with solidus and liquidus temperatures of 137.6 and 157.1°C, respectively, shows superior mechanical properties, e.g. the ultimate tensile strength of 57 MPa, elongation of 50%, and toughness of 20.6 × 106 J m−3, which is a promising material for low-temperature interconnection.
RaederC, FeltonL, TanziV, The effect of aging on microstructure, room temperature deformation, and fracture of Sn–Bi/Cu solder joints. J Electron Mater. 1994; 23(7):611–617.
2.
KimK, HuhS, SuganumaK.Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints. J Alloys Compd. 2003; 352(1–2):226–236.
3.
GainAK, ZhangL, QuadirMZ.Thermal aging effects on microstructures and mechanical properties of an environmentally friendly eutectic tin-copper solder alloy. Mater Des. 2016; 110:275–283.
LinS-k, ChenS-w.Interfacial reactions in the Sn–20 at.% In/Cu and Sn–20 at.% In/Ni couples at 160°C. J Mater Res. 2006; 21(7):1712–1717.
6.
ChenS-w, LinS-k.Effects of temperature on interfacial reactions in γ–InSn4/Ni couples. J Mater Res. 2006; 21(5):1161–1166.
7.
SuganumaK, KimK-S.Sn–Zn low temperature solder. In: SubramanianK.N., editor. Lead-free electronic solders. Boston, MA: Springer; 2006. p. 121–127.
8.
HirataY, YangC-h, LinS-k, Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In. Mater Sci Eng A. 2021; 813:141131.
9.
ShenY-A, ZhouS, LiJ, Sn–3.0Ag–0.5Cu/Sn–58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology. Mater Des. 2019; 183:108144.
10.
ZhouS, YangC-h, LinS-k, Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy. Mater Sci Eng A. 2019; 744:560–569.
11.
ZhouS, YangC-h, ShenY-A, The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength. Materialia. 2019; 6:100300.
12.
YangC-h, ZhouS, LinS-k, A computational thermodynamics-assisted development of Sn–Bi–In–Ga quaternary alloys as low-temperature Pb-free solders. Materials (Basel). 2019; 12(4):631.
13.
LinS-k, NguyenTL, WuS-c, Effective suppression of interfacial intermetallic compound growth between Sn–58wt.% Bi solders and Cu substrates by minor Ga addition. J Alloys Compd. 2014; 586:319–327.
14.
WangF, ChenH, HuangY, Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. J Mater Sci: Mater Electron. 2019; 30(4):3222–3243.
15.
AbtewM, SelvadurayG.Lead-free solders in microelectronics. Mater Sci Eng R. 2000; 27(5–6):95–141.
16.
ChenS-W, WangC-H, LinS-K, Phase diagrams of Pb-free solders and their related materials systems. In: SubramanianK.N., editor. Lead-free electronic solders. Boston, MA: Springer; 2006. p. 19–37.
17.
ChenX, XueF, ZhouJ, Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder. J Alloys Compd. 2015; 633:377–383.
18.
YangL, ZhouW, MaY, Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Mater Sci Eng A. 2016; 667:368–375.
19.
ZhouS, MokhtariO, RafiqueMG, . Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging. J Alloys Compd. 2018; 765:1243–1252.
20.
McCormackM, ChenH, KammlottG, Significantly improved mechanical properties of Bi–Sn solder alloys by Ag-doping. J Electron Mater. 1997; 26(8):954–958.
21.
SakuyamaS, AkamatsuT, UenishiK, Effects of a third element on microstructure and mechanical properties of eutectic Sn–Bi solder. Trans Jpn Inst Electron Packag. 2009; 2(1):98–103.
22.
ShenJ, PuY, YinH, Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys. J Alloys Compd. 2014; 614:63–70.
23.
PingW.Effects of Zn addition on mechanical properties of eutectic Sn–58Bi solder during liquid-state aging. Trans Nonferrous Met Soc China. 2015; 25(4):1225–1233.
24.
ZhouS, MokhtariO, RafiqueMG, Improvement in the mechanical properties of eutectic Sn–58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging. J Alloys Compd. 2018; 765:1243–1252.
25.
RibasM, ChegudiS, KumarA, Development of low-temperature drop shock resistant solder alloys for handheld devices. 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013); 2013. IEEE, p. 48–52.
26.
CaiS, LuoX, PengJ, Deformation mechanism of various Sn–xBi alloys under tensile tests. Adv Compos Hybrid Mater. 2021; 4(2):379–391.
27.
CaoW, ChenS-L, ZhangF, PANDAT software with PanEngine, PanOptimizer and PanPrecipitation for multi-component phase diagram calculation and materials property simulation. CALPHAD. 2009; 33(2):328–342.
28.
SilvaBL, GarciaA, SpinelliJE.Complex eutectic growth and Bi precipitation in ternary Sn–Bi–Cu and Sn–Bi–Ag alloys. J Alloys Compd. 2017; 691:600–605.
