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Research article

First published 1999-06

ISO 10303-Based PCB Assembly Data Model for Assembly Analysis

Thu-Hua Liu, Amy J. C. Trappey, Jen-Bin Shyu

Concurrent Engineering

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Research article

First published 1995-12

PRODUCT/PROCESS DESIGN IN MASS PLACEMENT PRINTED CIRCUIT BOARD ASSEMBLY

JAVAD H. AHMADI, REZA H. AHMADI, JAY RAO

Production and Operations Management

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Research article

First published 1994-5

Heuristic-Based Model for Microsequencing Components in Printed Circuit Board Assembly

Jose M. Sanchez, John W. Priest

Integrated Computer-Aided Engineering

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Research article

First published 2009-11

Evaluation of machinability in the micro end milling of printed circuit boards

J-B Park, K-H Wie, J-S Park [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

Free access

Research article

First published 2001-6

Task sequence optimization for a dual-robot assembly system using evolutionary algorithms

J-H Park, S-H Ryu

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2009-10

Comparison of Inelastic Behaviors of Lead-Free and Sn—Pb Solder Joints

Hsin-Chun Tsai, Wen-Ren Jong, Hsiu-Tao Chang

Journal of Reinforced Plastics and Composites

Open access

Research article

First published 2020

An intelligent approach for improving printed circuit board assembly process performance in smart manufacturing

Vincent WC Fung, Kam Chuen Yung

International Journal of Engineering Business Management

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Research article

First published 2011-8

A database system for decision support in low-volume electronics assembly

D M Segura Velandia, A A West, P P Conway

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2014-7

Fabrication and functionalization of PCB gold electrodes suitable for DNA-based electrochemical sensing

P. Salvo, O.Y.F. Henry, K. Dhaenens [...]

Bio-Medical Materials and Engineering

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Research article

First published 2007-08

The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Hsin-Chun Tsai, Wen-Ren Jong

Journal of Reinforced Plastics and Composites

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