ISO 10303-Based PCB Assembly Data Model for Assembly Analysis

Abstract

Today, time is one of the key factors in making a company the best in its industry. Translating information correctly and efficiently would reduce the time required to communicate between departments not only within a company but also among different companies. STEP, comprising many application protocols, is a standard for the exchange of product model data that has a great capability for describ ing product shape and managing product life cycle information. Therefore, effective information translation and the Concurrent Engineering (CE) could be achieved using STEP enabling technology. AP 210, an ISO/STEP committee drafted document, is an application protocol that describes printed circuit board (PCB) and PCB assembly product data. This paper focuses on the standard data modeling of PCB as sembly based on AP 210. The data models are implemented as object classes and used to demonstrate the evaluation analysis application of the PCB assembly.

Keywords

concurrent engineering application protocol PCB assembly STEP (ISO 10303)AP 210.

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