Sage Journals: Discover world-class research

Retricted access

Research article

First published 2022-10

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

Retricted access

Research article

First published 2022-8

Ultrasonic soldering silica glass and 2024 alloy in low temperature

Ruixiang Yi, Chao Chen, Haijun Li [...]

Science and Technology of Welding and Joining

Retricted access

Research article

First published 2022-10

High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling 1

Chih-han Yang, Yu-chen Liu, Yuki Hirata [...]

Science and Technology of Welding and Joining

Retricted access

Research article

First published 2026

Linking microstructure and high-frequency electrical performance in low-temperature SnBiIn-based solders for advanced packaging

Basem Abu Zneid, Firas Badri Abed, Ashutosh Pattanaik [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

Retricted access

Research article

First published 1995-1

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer

International Materials Reviews

Retricted access

Research article

First published 2013-3

Joining of 6061 aluminium ultrasonic soldered of Sn–Pb–Zn alloys

D Min

Materials Science and Technology

Retricted access

Research article

First published 2009-10

‘Spalling’ of SAC Pb free solders when used with nickel substrates

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Retricted access

Research article

First published 2009-12

Challenging gold based filler metals for uses in medicine

K. Bobzin, E. Lugscheider, F. Ernst [...]

Materials Science and Technology

Open access

Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

Retricted access

Research article

First published 2004-12

Influence of copper addition on adhesive strength of Sn–3Ag–1·5Sb solder joints

H.-T. Lee, M.-H. Chen, H.-M. Jao

Science and Technology of Welding and Joining

Search results