‘Spalling’ of SAC Pb free solders when used with nickel substrates

Abstract

The term “spalling” refers to the formation in a solder joint of a second layer of intermetallic compound, in addition to and separate from the usual single layer that normally forms on the substrate. It has been observed in Pb-free solders of the SAC type when used in conjunction with a nickel finish. Explanations offered to account for this phenomenon have been based on thermodynamic phase equilibria observed in isothermal sections of the Sn corner of the Cu–Ni–Sn system at temperatures 20°C or more above the solidification temperature of the solder, and without regard to reactions that occur at low temperatures, during freezing. Recent measurement of the liquidus projection of the Sn corner of the Cu–Ni–Sn system as shown the occurrence of a ternary quasiperitectic reaction in the composition range in which “spalling” is observed. Evaluation of the effect of this quasiperitectic reaction shows that its operation during freezing of the solder can account for the “spalling” phenomenon.