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Articles (25)

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1-10 of 25 results for Flip chip

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Select article: Experimental studies on application of silver paste in thermosonic flip-chip bonding

Open access

Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

Select article: The Geometrical Effects of Bumps on the Fatigue Life of Flip-chip Packages by Taguchi Method

Retricted access

Research article

First published 2006-01

The Geometrical Effects of Bumps on the Fatigue Life of Flip-chip Packages by Taguchi Method

Wen-Ren Jong, Shia-Chung Chen, Hsin-Chun Tsai [...]

Journal of Reinforced Plastics and Composites

Select article: Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

Retricted access

Research article

First published 2005-12

Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

G. H. Wu, T. C. Tsein, S. H. Ju

Journal of Reinforced Plastics and Composites

Select article: Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Retricted access

Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

Select article: Microstructural and textural analyses of flip chip bonded gold by orientation mapping

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Research article

First published 2005-12

Microstructural and textural analyses of flip chip bonded gold by orientation mapping

P. Yang, C. M. Li, D. M. Liu [...]

Materials Science and Technology

Select article: Shear test parameters for brittle fracture of flip chip solder joint

Retricted access

Research article

First published 2011-3

Shear test parameters for brittle fracture of flip chip solder joint

S.-S. Ha, J.-W. Kim, S.-O. Ha [...]

Materials Science and Technology

Select article: Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Retricted access

Research article

First published 2006-08

Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Y. K. Shen, P. T. Lin, S. W. Yeh

Journal of Reinforced Plastics and Composites

Select article: Effect of flip-chip bonding parameters on the property of passive UHF RFID tags with screen-printed antenna on fabric

Retricted access

Research article

First published 2023-8

Effect of flip-chip bonding parameters on the property of passive UHF RFID tags with screen-printed antenna on fabric

Fenye Meng, Jiyong Hu

Textile Research Journal

Select article: Scaling effect on Ag 3 Sn growth behaviours in micro-joints for flip chip assemblies

Retricted access

Research article

First published 2018-10

Scaling effect on Ag 3 Sn growth behaviours in micro-joints for flip chip assemblies

Ye Tian, Ning Ren, Xiaoxia Jian [...]

Science and Technology of Welding and Joining

Select article: Analysis of the Mold Filling Process on Flip Chip Package

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Other

First published 2004-03

Analysis of the Mold Filling Process on Flip Chip Package

Y. K. Shen, S. H. Chen, H. C. Lee

Journal of Reinforced Plastics and Composites

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