Orientation mapping based on electron backscatter diffraction (EBSD) technique is applied to reveal microstructural and textural characteristics of flip chip bonded Au at its different processing stages. Attention is paid also to the influence of thermosonic energy. It is found that columnar grains in free air ball (FAB) that inherit the orientations of heat affected zone (HAZ) and layer formed grains are formed at first bonding interface owing to the thermosonic vibration. Recrystallised grains are occasionally detected between the heavily strained boundary region and the less strained centre region.
JordanJ.: Proc. Symp. SEMICON West 2002 on ‘International electronics manufacturing technology’, Piscataway, NJ, USA, July 2002, SEMICON,110–114.
2.
PangC.-H., HungK.-Y. and ShanM.-L.: Proc. Conf. on ‘Electronic components and technology'Arlington, VA, USA, June 2004, University of Science and Technology Beijing (USTB) and ASM Assembly Ltd (Hong Kong),1461–1465.
3.
SarawatiT., SritharanC., BreachD., WulffF. and MhaisalkarS. G.: Proc. Conf. IEEE/2003 on ‘Electronics packaging technology’, Tokyo, Japan, April 2003, IEEE,569–573.
4.
KangS. H., JungH. S., BangW. H., ChoJ. H., OhK. H., KimD. S., ChoJ. S., ParkY. J. and ParkS. H.: Mater. Set Forum, 2005, 495-497, 907–912.
5.
TanidaK., UmemotoM., TomitaY., TagoM., KajiwaraR., AkiyamaY. and TakahashiK.: Jpn J. AppL Phys., 2003, 42, (Pt.1 No. 4B),2198–2203.
6.
WulffF., BreachC. D. and DittmerK.: J. Mater. Sci. Lett., 2003, 22, 1373–1376.
7.
ChoJ. H., ChoJ. S., MoonJ. T., LeeJ., ChoY. H., KimY. W., RollettA. D. and OhK. H.: Metall Mater. Trans., 2003, 34A, 1113–1125.
8.
RatchevP., CarbonellL., HoH. M. and VerlindenB.: Proc. 28th Int.Symp. on ‘Testing and failure analysis’, Phoenix, Arizona, USA, USTB ans ASM Assembly Ltd (Hong Kong) November 2002, pp. 6.
9.
HongS.-J., ChoJ.-S., MoonJ.-T. and LeeJ.: Proc. Int. Symp. on ‘Electronic materials and packaging’, 52-55; 19 November 2001, Cheju Island, Korea, USTB and ASM Assembly Ltd (Hong Kong),52–55.
10.
MuraliS., SrikanthN. and VathC. J.III:Mater. Charact., 2005, 54, 93–95.
