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Research article

First published 2023-3

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Hui Yang, Zhengbang Zhan

Journal of Low Frequency Noise,Vibration and Active Control

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Research article

First published 2005-12

Microstructural and textural analyses of flip chip bonded gold by orientation mapping

P. Yang, C. M. Li, D. M. Liu [...]

Materials Science and Technology

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Research article

First published 2023-8

Effect of flip-chip bonding parameters on the property of passive UHF RFID tags with screen-printed antenna on fabric

Fenye Meng, Jiyong Hu

Textile Research Journal

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Research article

First published 1998-09

Stacking Technology for a Space Constrained Microsystem

M. Heschel, J. F. Kuhmann, S. Bouwstra [...]

Journal of Intelligent Material Systems and Structures

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Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

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Research article

First published 2011-3

Shear test parameters for brittle fracture of flip chip solder joint

S.-S. Ha, J.-W. Kim, S.-O. Ha [...]

Materials Science and Technology

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Research article

First published 1994-11

Solidification and microstructure of eutectic Pb–Sn microsolder bonds

N. R. Green, J. A. Charles, G. C. Smith

Materials Science and Technology

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Research article

First published 2000-6

“Microflex”—A New Assembling Technique for Interconnects

Thomas Stieglitz, Hansjoerg Beutel, J. -Uwe Meyer

Journal of Intelligent Material Systems and Structures

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