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Articles (18)

Journals (0)

1-10 of 18 results for EUTECTIC SN–CU SOLDER

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Select article: Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

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Research article

First published 2009-12

Interfacial reaction and mechanical reliability of eutectic Sn–0·7Cu/immersion Ag-plated Cu solder joint

J.-W. Yoon, S.-B. Jung

Materials Science and Technology

Select article: Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels

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Research article

First published 2019-9

Dendritic and eutectic growth of Sn–0.5 wt.%Cu solders with low alloying Al levels

Thiago Soares Lima, Bismarck Luiz Silva, Amauri Garcia [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

Select article: Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

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Research article

First published 2007-4

Effect of high temperature storage test on reliability of eutectic Sn–Cu/ENIG solder joint

J.-W. Yoon, S.-W. Kim, S.-B. Jung

Materials Science and Technology

Select article: Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

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First published 2008-6

Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad

F. Q. Li, C. Q. Wang, Y. H. Tian

Materials Science and Technology

Select article: Microstructures formed from mixed solders on copper substrate

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Research article

First published 2009-12

Microstructures formed from mixed solders on copper substrate

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

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Research article

First published 2005-6

Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

H. T. Lee, Y. H. Lee

Science and Technology of Welding and Joining

Select article: Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

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Research article

First published 2022-4

Three-dimensional interface and property of SnPb solder joint under extreme thermal shocking

Jianhao Wang, Songbai Xue, Lu Liu [...]

Science and Technology of Welding and Joining

Select article: Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

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Research article

First published 2005-1

Effect of cooling rate on microstructure of Ag–Cu–Sn solder alloys

L. Snugovsky, P. Snugovsky, D. D. Perovic [...]

Materials Science and Technology

Select article: Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

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Research article

First published 2003-10

Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

H. Kato, K. Matsubara, K. Kageyama

Materials Science and Technology

Select article: Metallurgy of low temperature Pb-free solders for electronic assembly

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Research article

First published 1995-1

Metallurgy of low temperature Pb-free solders for electronic assembly

J. Glazer

International Materials Reviews

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