To meet the demand of cryogenic reliability on the electronic packaging for deep space satellite, the three-dimensional interfacial morphology and property of eutectic SnPb solder joint under an extreme thermal shocking of 77–423 K were investigated. After thermal shocking, Cu-Sn IMC layers coarsened in the cross-sectional observation and micro-cracks formed in Cu6Sn5 layer. The rough Cu6Sn5 layer in the top view gradually smoothed, with broken Cu6Sn5 particles and exposed Cu3Sn. In the bottom-view observation, the Cu6Sn5 layer of as-soldered joint was overlapped by Cu3Sn layer. But no defects were generated in Cu3Sn layer. The shear force of solder joint was greatly reduced due to broken Cu6Sn5 with the changing fracture characteristics from the solder-controlled mode to the solder/IMC mixed mode.
MurdockTL, NeyEP.Mercury: the dark-side temperature. Science 1970; 170(3957):535–537.
2.
LeeSH, MudawarI, HasanMM.Thermal analysis of hybrid single-phase, two-phase and heat pump thermal control system (TCS) for future spacecraft. Appl Therm Eng. 2016; 100:190–214.
3.
KirschmanRK, SokolowskiWM, KolawaEA.Die attachment for −120°C to +20°C thermal cycling of microelectronics for future Mars rovers – an overview. J Electron Packag. 2000; 123(2):105–111.
4.
WangH, HuX, JiangX.Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints. Mater Charact. 2020; 163:110287.
5.
LiM-l, GaoL-l, ZhangL, Interfacial evolution of pure Sn solder bearing silicon carbide nanowires under isothermal aging and thermal cycling. J Mater Res Technol. 2021; 15:3974–3982.
6.
QiaoY, MaH, YuF, Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient. Acta Mater. 2021; 217:117168.
7.
CuiJ, ZhangK, ZhaoD, Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling. Sci Rep. 2021; 11(1):6297.
8.
TeoJWR, SunYF.Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading. Acta Mater. 2008; 56(2):242–249.
9.
TianR, HangC, TianY, Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock. Mater Sci Eng A. 2018; 709:125–133.
10.
FengW, WangC, MorinagaM.Electronic structure mechanism for the wettability of Sn-based solder alloys. J Electron Mater. 2002; 31(3):185–190.
11.
JiX, AnQ, XiaY, Maximum shear stress-controlled uniaxial tensile deformation and fracture mechanisms and constitutive relations of Sn-Pb eutectic alloy at cryogenic temperatures. Mater Sci Eng A. 2021; 819:141523.
12.
TuKN, ZengK.Tin-lead (SnPb) solder reaction in flip chip technology. Mater Sci Eng R. 2001; 34(1):1–58.
13.
LiuP, YaoP, LiuJ.Evolutions of the interface and shear strength between SnAgCu–xNi solder and Cu substrate during isothermal aging at 150°C. J Alloys Compd. 2009; 486(1):474–479.
14.
WangH, HuX, JiangX, Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux. J Manuf Process. 2021; 62:291–301.
15.
KimHK, LiouHK, TuKN.Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu. Appl Phys Lett. 1995; 66(18):2337–2339.
16.
MarquesVMF, JohnstonC, GrantPS.Nanomechanical characterization of Sn–Ag–Cu/Cu joints—part 1: young's modulus, hardness and deformation mechanisms as a function of temperature. Acta Mater. 2013; 61(7):2460–2470.
17.
ZhangR, TianY, HangC, Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints. Mater Lett. 2013; 110:137–140.
18.
LeeTY, ChoiWJ, TuKN, Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu. J Mater Res. 2002; 17(2):291–301.
19.
NishikawaH, IwataN.Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag-Cu solder on a Cu Pad. J Mater Process Technol. 2015; 215:6–11.
20.
WuJ, XueS, WangJ, Effect of thermal cycling on interfacial microstructure and mechanical properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) nanoparticles/Cu low-Ag solder joints. J Electron Mater. 2019; 48(7):4562–4572.
21.
PangHLJ, TanKH, ShiXQ, Microstructure and intermetallic growth effects on shear and fatigue strength of solder joints subjected to thermal cycling aging. Mater Sci Eng A. 2001; 307(1):42–50.
22.
TianR, HangC, TianY, Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment. J Alloys Compd. 2019; 777:463–471.
23.
MinhoO, VakanasG, MoelansN, Formation of compounds and Kirkendall vacancy in the Cu–Sn system. Microelectron Eng. 2014; 120:133–137.
24.
XuL, PangJHL, CheF.Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability. J Electron Mater. 2008; 37(6):880–886.
25.
HuX, XuT, KeerLM, Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints. Mater Sci Eng A. 2016; 673:167–177.
26.
WangJ, XueS, WangJ, Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking. J Mater Sci Mater Electron. 2020; 31(7):5731–5737.
27.
LeeH-T, LinH-S, LeeC-S, Reliability of Sn-Ag-Sb lead-free solder joints. Mater Sci Eng A. 2005; 407(1):36–44.
28.
YazzieKE, FeiHE, JiangH, Rate-dependent behavior of Sn alloy-Cu couples: Effects of microstructure and composition on mechanical shock resistance. Acta Mater. 2012; 60(10):4336–4348.
29.
HuX, ChenW, YuX, Shear strengths and fracture behaviors of Cu/Sn37Pb/Cu soldered joints subjected to different displacement rates. J Alloys Compd. 2014; 600:13–20.
30.
TianY, HangC, WangC, Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing. Mater Sci Eng A. 2011; 529:468–478.
31.
JangG-Y, LeeJ-W, DuhJ-G.The nanoindentation characteristics of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds in the solder bump. J Electron Mater. 2004; 33(10):1103–1110.
32.
GuiZ, HuX, JiangX, Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux. J Mater Sci Mater Electron. 2021; 32(19):24507–24523.
33.
YangL, ZhuL, ZhangY, Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling. Mater Charact. 2019; 148:280–291.
