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Research article

First published 2021-1

Microstructure,mechanical properties,and electrical conductivity of the solid-state recycled pure copper machining chips

Reza Abdi Behnagh, Hadi Abdollahi, Mohsen Agha Mohammad Pour [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2011-7

Mechanical alloying of Cu–SiC materials prepared with utilisation of copper waste chips

A S Prosviryakov, A A Aksenov, M E Samoshina [...]

Powder Metallurgy

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Research article

First published 2018-6

Experimental investigation of the influence of chip interference on burr height in machining micro V-grooves on electroplated copper roll die

Zheng Qiao, Da Qu, Huiming Wang [...]

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2024-11

Performance assessment of aluminum chips in reduced-scale friction for developing copper-free elastomer-modified friction composites

Prosenjit Ghosh

Progress in Rubber,Plastics and Recycling Technology

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Research article

First published 2020-5

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Madhav Datta

Journal of Micromanufacturing

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Research article

First published 2024-2

Investigation of the performance of recycled copper swarf tool electrode processed through bound powder extrusion for micromachining

Navaneetha Krishnan Srinivasan, Raj Mohan Radhakrishnan, Raghuraman Srinivasan [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2021-5

Investigation of effect of uncut chip thickness to edge radius ratio on nanoscale cutting behavior of single crystal copper: MD simulation approach

A. Sharma, P. Ranjan, R. Balasubramaniam

Journal of Micromanufacturing

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Research article

First published 2021

Investigation on mechanical properties and deformation behavior of copper-based three-phase metal matrix composite: Experimental and micro-macro-mechanical finite element analysis

Ambuj Saxena, Shashi Prakash Dwivedi, Nagendra Kumar Maurya [...]

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2019-5

SiO 2 -coated Cu nanoparticle/epoxy resin composite and its application in the chip packaging field

Qing Tian, Junhui Li, Xiao Huiwei [...]

High Performance Polymers

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Research article

First published 2025-8

Pool boiling heat transfer performance analysis of DI water on copper chips coated with nano thin layered zinc oxides

Sanjay Kumar Gupta

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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