You are on the new improved site. You can view the old site in view-only mode here until June 27, 2026

Filter Results

Search all journals

Enter search terms…

Advanced search

/

About

About Sage
About Sage Journals
Privacy Policy
Terms of Use
Contact Us
Help

Information for

Authors
Editors
Librarians
Researchers
Reviewers
Frequently asked questions

Copyright © 2026 by Sage Publications.京ICP备09090397号-11

Search results

Search results page

Articles (11)

Journals (0)

1-10 of 11 results for CHIP SCALE PACKAGE

Sort by:

Relevance

Select all

Select all

Sort by:

Relevance

Select article: Mechanical strength of chip scale package with various underfills under accelerated thermal condition

Retricted access

Research article

First published 2007-7

Mechanical strength of chip scale package with various underfills under accelerated thermal condition

B.-I. Noh, B.-Y. Lee, S.-B. Jung

Materials Science and Technology

Select article: A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

Retricted access

Research article

First published 2009-10

A Study on the Effect of Epoxy Molding Compound (EMC) Rheology During Encapsulation of Stacked-CHIP Scale Packages (S-CSP)

M. Khalil Abdullah, M.Z. Abdullah, M.A. Mujeebu [...]

Journal of Reinforced Plastics and Composites

Select article: Opinion: Chip scale packaged LEDs are far away from mass production

Retricted access

Research article

First published 2017-12

Opinion: Chip scale packaged LEDs are far away from mass production

Peng Ge

Lighting Research & Technology

Select article: The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Retricted access

Research article

First published 2007-08

The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Hsin-Chun Tsai, Wen-Ren Jong

Journal of Reinforced Plastics and Composites

Select article: Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Retricted access

Research article

First published 2011-11

Effects of package geometry on thermal fatigue life and microstructure of Sn–Ag–Cu solder joint

Z Zeng, X B Li, L Li [...]

Materials Science and Technology

Select article: An ASIC Design for Versatile Receive Front-End Electronics of an Ultrasonic Medical Imaging System — 16 Channel Analog Inputs and 4 Dynamically Focused Beam Outputs

Retricted access

Research article

First published 2003-4

An ASIC Design for Versatile Receive Front-End Electronics of an Ultrasonic Medical Imaging System — 16 Channel Analog Inputs and 4 Dynamically Focused Beam Outputs

Song B. Park, Jaeyoung Kwak, Kwyro Lee

Ultrasonic Imaging

Select article: Analysis of the Mold Filling Process on Flip Chip Package

Retricted access

Other

First published 2004-03

Analysis of the Mold Filling Process on Flip Chip Package

Y. K. Shen, S. H. Chen, H. C. Lee

Journal of Reinforced Plastics and Composites

Select article: Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages

Retricted access

Research article

First published 2001-7

Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages

Raghuram Pucha, James Pyland, Suresh K. Sitaraman

International Journal of Damage Mechanics

Select article: Clock-tree synthesis for low-EMI design

Retricted access

Research article

First published 2009-8

Clock-tree synthesis for low-EMI design

Davide Pandini, Guido A. Repetto, Vincenzo Sinisi

Journal of Embedded Computing

Select article: Comparison of Inelastic Behaviors of Lead-Free and Sn—Pb Solder Joints

Retricted access

Research article

First published 2009-10

Comparison of Inelastic Behaviors of Lead-Free and Sn—Pb Solder Joints

Hsin-Chun Tsai, Wen-Ren Jong, Hsiu-Tao Chang

Journal of Reinforced Plastics and Composites

1
2
10 / page

Article type

Publication date

Subjects

Access