Abstract
Circularly scanned-beam laminography is currently the predominant technique used for the nondestructive examination of printed circuit solder assemblies via cross-sectional X-ray imaging. Given industry trends towards double-sided assemblies and limited access components, cross-sectional X-ray inspection is furthermore becoming increasingly important. Use of X-rays for inspection of solder joints on loaded printed circuit boards nonetheless often leads to concern surrounding possible undesirable radiation effects on the circuitry mounted on the board. In this paper we develop a simple analytical model useful for predicting the radiation exposure rates in a scanned-beam laminography system. We demonstrate the validity of the model through a series of dosimetry experiments.
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